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TLC1541IFNG3

Texas Instruments

TLC1541IFNG3 by Texas Instruments

TLC1541IFNG3 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% max linearity error, and 0.032258 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within -40 to 85 °C temperature range. Package style: chip carrier, surface mountable, and outputs binary data serially.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,779 parts In-Stock

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Digiode

USA . 3,021 parts In-Stock

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3,021

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Distributors (Availability)

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AZTECH Wire

Italy . 774 parts In-Stock

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$6.308

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774

$6.308

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Parana Technologies

USA . 636 parts In-Stock

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$17.982

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$18.143

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636

$17.982

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$18.143

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DigiPath Technology Company

USA . 248 parts In-Stock

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$19.800

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$18.216

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248

$19.800

$18.216

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ChromeModa Solutions

Germany . 4,428 parts In-Stock

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$20.204

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$16.567

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4,428

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$16.567

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

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$20.204

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$19.194

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$18.184

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2,070

$20.204

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$18.184

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One Stop Electronics

USA . 1,219 parts In-Stock

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$38.000

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Corphita

USA . 4,559 parts In-Stock

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Microchip USA

USA . 348 parts In-Stock

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Assy Fe

Spain . 38 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the TLC1541IFNG3 by Texas Instruments. Renowned for their top-notch quality and innovation, Texas Instruments delivers a cutting-edge solution with this 10-bit ADC. Perfect for applications requiring precision and speed, this chip carrier package offers 11 analog input channels and a maximum linearity error of just 0.0977%. With an industrial temperature grade and a sample rate of 0.032258 MHz, this ADC is the ideal choice for your high-performance designs. Upgrade your projects today with Texas Instruments TLC1541IFNG3!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

No. of Analog In Channels: 11

With 11 analog input channels, this product offers the flexibility to handle multiple signals simultaneously.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into compact electronic designs.

No. of Bits: 10

The 10-bit resolution ensures accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0977%

The low linearity error percentage ensures precise conversion of analog signals with minimal distortion.

No. of Terminals: 20

The 20 terminals provide ample connection points for interfacing the converter with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments with varying heat levels.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to perform reliably in cold environments as well.

Terminal Finish: MATTE TIN

The matte tin finish on terminals provides good solderability and corrosion resistance.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and enhances connectivity.

Maximum Conversion Time: 21 us

The fast conversion time ensures real-time processing of analog data.

Width: 8.965 mm

The compact width makes the product suitable for space-constrained designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's performance and reliability in harsh operating conditions.

Sample Rate: 0.032258 MHz

The high sample rate enables the converter to capture fast-changing analog signals accurately.

Technology: CMOS

The CMOS technology used in the converter offers low power consumption and high noise immunity.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high accuracy and efficiency in converting analog signals.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage makes the product compatible with a wide range of electronic systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and analysis.

Output Format: SERIAL

The serial output format enables easy interfacing with microcontrollers and other digital devices.

Technical Specifications

Analog-to-Digital Converters TLC1541IFNG3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

32.258 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J20

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

TLC1541IFNG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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