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TL442MJ

Texas Instruments

TL442MJ by Texas Instruments

TL442MJ by Texas Instruments is a 14-terminal RF/Microwave Mixer with ceramic package. Operating temp range: -55 to 125°C, using bipolar technology. Ideal for through-hole mounting in various applications like signal processing and communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,606 parts In-Stock

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Digiode

USA . 913 parts In-Stock

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913

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Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

$2.538

100+ parts

-

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$3.027

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2,303

$2.538

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$3.027

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IDEA Electronic Components Group

UK . 2,225 parts In-Stock

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$2.852

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$2.567

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$2.852

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$2.567

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ChromeModa Solutions

Germany . 128 parts In-Stock

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$2.852

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$2.339

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128

$2.852

$2.339

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AZTECH Wire

Italy . 578 parts In-Stock

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$5.620

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578

$5.620

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One Stop Electronics

USA . 694 parts In-Stock

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$6.000

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694

$6.000

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Ampacity Inc.

Singapore . 536 parts In-Stock

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$17.000

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536

$17.000

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Semicontronic

India . 388 parts In-Stock

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$31.000

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$30.225

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$30.070

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$31.000

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DigiPath Technology Company

USA . 734 parts In-Stock

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$2.571

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$2.571

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Corphita

USA . 561 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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Overview

Elevate your RF/Microwave Mixer game with the TL442MJ by Texas Instruments. Crafted with precision and quality in mind, this ceramic-packaged gem boasts 14 terminals and operates flawlessly in temperatures ranging from -55 to 125°C. Whether you're in the aerospace, defense, or telecommunications industries, this bipolar technology marvel delivers unmatched performance and reliability. Say goodbye to limitations and hello to endless possibilities with the TL442MJ. Elevate your RF/Microwave Mixer game with the TL442MJ by Texas Instruments. Crafted with precision and quality in mind, this ceramic-packaged gem boasts 14 terminals and operates flawlessly in temperatures ranging from -55 to 125°C. Whether you're in the aerospace, defense, or telecommunications industries, this bipolar technology marvel delivers unmatched performance and reliability. Say goodbye to limitations and hello to endless possibilities with the TL442MJ.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic materials offer excellent thermal conductivity and are highly stable in temperature changes. This ensures reliable performance in a wide range of operating conditions.

No. of Terminals: 14

Having 14 terminals allows for versatility in connectivity options and signal processing capabilities, making it suitable for complex RF/microwave applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the mixer can withstand demanding environmental conditions without compromising performance or reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables the mixer to function effectively in colder environments, providing consistent performance across a wide temperature range.

Technology: BIPOLAR

Bipolar technology offers high linearity and low noise performance, making the mixer ideal for applications where signal quality and accuracy are crucial.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature simplifies the installation process and provides a secure and reliable connection, reducing potential signal loss and interference.

Technical Specifications

RF/Microwave Mixers TL442MJ attributes and parameters. Explore more RF/Microwave Mixers devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

Package Equivalence Code:

DIP14,.3

Sub-Category:

RF/Microwave Mixers

Technology:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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