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TL442CJ4

Texas Instruments

TL442CJ4 by Texas Instruments

TL442CJ4 by Texas Instruments is a 14-terminal RF/Microwave Mixer with ceramic package. Operating temp range: 0-70°C, technology: bipolar. Ideal for through-hole mounting in various applications requiring high-frequency signal mixing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,664 parts In-Stock

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Digiode

USA . 199 parts In-Stock

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199

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Parana Technologies

USA . 2,112 parts In-Stock

1+ parts

$1.174

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-

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$1.979

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2,112

$1.174

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$1.979

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DigiPath Technology Company

USA . 2,377 parts In-Stock

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$1.293

100+ parts

$1.189

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2,377

$1.293

$1.189

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ChromeModa Solutions

Germany . 3,670 parts In-Stock

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$1.319

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$1.082

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3,670

$1.319

$1.082

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IDEA Electronic Components Group

UK . 453 parts In-Stock

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$1.319

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$1.187

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453

$1.319

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$1.187

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One Stop Electronics

USA . 542 parts In-Stock

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$3.000

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542

$3.000

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AZTECH Wire

Italy . 258 parts In-Stock

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$11.969

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258

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Ampacity Inc.

Singapore . 1,212 parts In-Stock

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$24.000

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$24.000

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Semicontronic

India . 1,618 parts In-Stock

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$28.000

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$27.300

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$27.160

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Corphita

USA . 3,286 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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Overview

Elevate your RF/Microwave applications with the TL442CJ4 by Texas Instruments. Crafted with precision and expertise, this ceramic packaged mixer offers unparalleled quality and reliability. With a bipolar technology and through hole mount feature, this product guarantees optimal performance even in extreme temperatures. Experience seamless integration and enhanced efficiency in your projects with the TL442CJ4. Unlock new possibilities and achieve superior results with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable material that offers excellent thermal properties, making it ideal for high temperature applications. It also provides good electrical insulation, enhancing the reliability and performance of the mixer.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity and integration with other components in RF/microwave systems. This flexibility enables the mixer to be easily incorporated into various circuit designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the mixer can handle demanding thermal environments without compromising its performance. This reliability is crucial for stable operation over extended periods.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C indicates that the mixer can function effectively in colder conditions, offering a wide operating temperature range. This adaptability makes it suitable for diverse operating environments.

Technology: BIPOLAR

Bipolar technology provides good linearity and low noise characteristics, resulting in high performance in RF/microwave applications. The mixer's bipolar design ensures efficient signal mixing with minimal distortion, making it a reliable choice for signal processing.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature enables secure and stable installation of the mixer onto circuit boards or other surfaces. This robust mounting method ensures mechanical stability, reducing the risk of damage or disconnection during operation.

Technical Specifications

RF/Microwave Mixers TL442CJ4 attributes and parameters. Explore more RF/Microwave Mixers devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

Package Equivalence Code:

DIP14,.3

Sub-Category:

RF/Microwave Mixers

Technology:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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