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TL442CN3

Texas Instruments

TL442CN3 by Texas Instruments

TL442CN3 by Texas Instruments is a 14-terminal RF/Microwave Mixer with bipolar technology. It operates b/w 0°C to 70°C, featuring a plastic/epoxy package body material for through-hole mounting. Ideal for applications requiring high-frequency signal mixing in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,683 parts In-Stock

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6,683

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Digiode

USA . 2,468 parts In-Stock

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2,468

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 805 parts In-Stock

1+ parts

$1.794

100+ parts

-

1k+ parts

$2.353

10k+ parts

-

805

$1.794

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$2.353

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$1.976

100+ parts

-

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1,389

$1.976

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IDEA Electronic Components Group

UK . 2,146 parts In-Stock

1+ parts

$2.016

100+ parts

-

1k+ parts

$1.814

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2,146

$2.016

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$1.814

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ChromeModa Solutions

Germany . 148 parts In-Stock

1+ parts

$2.016

100+ parts

$1.653

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148

$2.016

$1.653

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AZTECH Wire

Italy . 847 parts In-Stock

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$6.483

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847

$6.483

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Ampacity Inc.

Singapore . 1,514 parts In-Stock

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$18.000

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1,514

$18.000

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One Stop Electronics

USA . 1,147 parts In-Stock

1+ parts

$33.000

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1,147

$33.000

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Semicontronic

India . 1,016 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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1,016

$33.000

$32.175

$32.010

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Corphita

USA . 4,697 parts In-Stock

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4,697

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Corohmni

South Africa . 375 parts In-Stock

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375

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Overview

Elevate your RF/Microwave Mixer game with the TL442CN3 by Texas Instruments. Known for their top-quality electronic components, Texas Instruments brings you a reliable and versatile solution for your mixing needs. Whether you're working on telecommunications, radar systems, or satellite communications, this mixer offers unmatched performance and precision. Say goodbye to signal loss and distortion, and hello to seamless integration and enhanced efficiency. Upgrade your projects today with the TL442CN3, where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to impacts, making the product suitable for various applications in different environments.

No. of Terminals: 14

Having more terminals allows for more connectivity options, increasing flexibility in system integration and design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures reliability and stability of the product even in demanding operating conditions.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature of 0°C, the product can function effectively in a wide range of temperature environments, providing consistent performance.

Technology: BIPOLAR

Bipolar technology offers high linearity and low noise performance, making the mixer ideal for RF/microwave applications where precision and signal quality are crucial.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and provides secure and stable mounting, ensuring reliable operation even in high-vibration environments.

Technical Specifications

RF/Microwave Mixers TL442CN3 attributes and parameters. Explore more RF/Microwave Mixers devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

Package Equivalence Code:

DIP14,.3

Sub-Category:

RF/Microwave Mixers

Technology:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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