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TDA6403A

NXP Semiconductors

TDA6403A by NXP Semiconductors

TDA6403A by NXP Semiconductors is a surface-mount RF/microwave mixer designed for efficient signal processing. It operates on a 5V supply, with a temp range of -20 °C to 85 °C and features 28 terminals. Ideal for communication systems, it utilizes bipolar technology for enhanced performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,854 parts In-Stock

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2,854

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Anansix

USA . 2,590 parts In-Stock

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2,590

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Vyrian

USA . 1,331 parts In-Stock

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1,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,632 parts In-Stock

1+ parts

$28.000

100+ parts

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1,632

$28.000

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UNI Independent Distributors

Spain . 3,318 parts In-Stock

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3,318

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Corphita

USA . 1,373 parts In-Stock

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1,373

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Overview

Unlock superior performance with the TDA6403A from NXP Semiconductors, a trusted leader in innovation. This RF/Microwave mixer delivers exceptional quality and reliability, making it ideal for diverse applications from telecommunications to industrial automation. Benefit from its robust construction and versatile design, ensuring seamless integration into your projects while enhancing signal clarity and efficiency. Elevate your technology with NXP’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making the product reliable for various applications.

Power Supplies (V): 5

A low power supply requirement of 5V makes this mixer energy-efficient and suitable for integration into battery-operated systems.

No. of Terminals: 28

With 28 terminals, this product offers ample connectivity options for complex circuit designs, enhancing versatility in applications.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C allows the product to function reliably in high-temperature environments, suitable for various industrial applications.

Minimum Operating Temperature: -20 °C

A minimum operating temperature of -20 °C ensures that the mixer can perform in colder climates, making it versatile for different environments.

Technology: BIPOLAR

The bipolar technology enhances performance characteristics like linearity and noise figure, which are critical for RF/microwave applications.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for compact designs and easy integration into PCBs, optimizing space and manufacturing efficiency.

Technical Specifications

RF/Microwave Mixers TDA6403A attributes and parameters. Explore more RF/Microwave Mixers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

SSOP28,.3

Power Supplies (V):

5

Sub-Category:

RF/Microwave Mixers

Technology:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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