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TL16C752BPT

Texas Instruments

TL16C752BPT by Texas Instruments

TL16C752BPT by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 0.375 MBps data transfer rate, and 48 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a 48-pin flatpack package with gull wing terminals and operates in temperatures ranging from -40 to 85°C.

Median Price

$18.612

Lifecycle Status

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Freelance Electronics

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LIBRA Elektronik GmbH

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Holdelec - ElecDif-Pro

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Carlin Systems, Inc.

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Bristol Electronics

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AZTECH Wire

Italy . 280 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,877 parts In-Stock

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ChromeModa Solutions

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Overview

Enhance your communication systems with the TL16C752BPT from Texas Instruments, a top-quality Serial Communication Controller that promises seamless data transfer and reliable performance. With a focus on innovation and excellence, Texas Instruments delivers cutting-edge technology to meet all your connectivity needs. This versatile controller is perfect for a wide range of applications, offering high value and efficiency to customers looking to optimize their systems. Upgrade your devices today and experience the benefits of superior connectivity with the TL16C752BPT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides a durable and lightweight package for the controller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this controller can handle higher power requirements and voltages, offering versatility in usage.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate of 0.375 MBps enables fast and efficient communication, ideal for applications that require quick data exchange.

Maximum Clock Frequency: 48 MHz

A high maximum clock frequency of 48 MHz allows for speedy and responsive processing of data, enhancing overall performance.

Temperature Grade: INDUSTRIAL

Being industrial-grade, this controller can withstand harsh environmental conditions and temperature fluctuations, ensuring reliable operation in demanding settings.

Technical Specifications

Serial Communication Controllers TL16C752BPT attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C752BPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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