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TL16C554AIPNRG4

Texas Instruments

TL16C554AIPNRG4 by Texas Instruments

TL16C554AIPNRG4 by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 0.125 MBps data transfer rate, and 16 MHz clock frequency. Ideal for industrial applications requiring asynchronous communication protocols and 8-bit external data bus width.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,722 parts In-Stock

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Vyrian

USA . 2,679 parts In-Stock

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2,679

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Distributors (Availability)

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One Stop Electronics

USA . 934 parts In-Stock

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$7.000

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934

$7.000

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AZTECH Wire

Italy . 209 parts In-Stock

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$8.657

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Parana Technologies

USA . 1,609 parts In-Stock

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$66.535

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DigiPath Technology Company

USA . 333 parts In-Stock

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$73.263

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333

$73.263

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

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$74.758

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$71.020

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$67.282

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1,278

$74.758

$71.020

$67.282

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ChromeModa Solutions

Germany . 577 parts In-Stock

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$74.758

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$61.302

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577

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Microchip USA

USA . 4,586 parts In-Stock

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Corphita

USA . 4,584 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Overview

Enhance your communication systems with the TL16C554AIPNRG4 by Texas Instruments, a high-quality Serial Communication Controller designed for industrial-grade applications. With a maximum data transfer rate of 0.125 MBps and a wide operating temperature range, this product offers reliable performance in various environments. Its advanced technology and robust construction make it ideal for serial IO and communication control tasks. Upgrade your systems today with the TL16C554AIPNRG4 and experience seamless, efficient data transfer like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the serial communication controller.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The controller can operate at a high supply voltage, making it suitable for various applications that require higher voltages.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the circuit board and provides a compact design for the overall system.

Maximum Data Transfer Rate: 0.125 MBps

With a high data transfer rate, this controller can efficiently handle large amounts of data, making it suitable for high-speed communication applications.

Maximum Clock Frequency: 16 MHz

The high clock frequency capability allows for fast processing of data and efficient communication between devices connected to the controller.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the controller can operate reliably in harsh and demanding environments, making it suitable for industrial applications.

Technical Specifications

Serial Communication Controllers TL16C554AIPNRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TL16C554AIPNRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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