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TL16C554AIPNR

Texas Instruments

TL16C554AIPNR by Texas Instruments

TL16C554AIPNR by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 16MHz clock frequency, and 0.125MBps data transfer rate. Ideal for industrial applications requiring high-speed asynchronous communication over 4 serial I/Os in a compact low-profile package.

Median Price

$22.230

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 15 parts In-Stock

1+ parts

$22.100

100+ parts

$16.900

1k+ parts

$15.000

10k+ parts

-

15

$22.100

$16.900

$15.000

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Arrow

USA . 809 parts In-Stock

1+ parts

$22.230

100+ parts

$17.870

1k+ parts

$16.790

10k+ parts

-

809

$22.230

$17.870

$16.790

-

Verical

USA . 809 parts In-Stock

1+ parts

$22.230

100+ parts

$17.870

1k+ parts

$16.790

10k+ parts

-

809

$22.230

$17.870

$16.790

-

Mouser Electronics

USA . 282 parts In-Stock

1+ parts

$32.800

100+ parts

$21.920

1k+ parts

$19.100

10k+ parts

-

282

$32.800

$21.920

$19.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,100 parts In-Stock

1+ parts

$12.360

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2,100

$12.360

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Vyrian

USA . 7,099 parts In-Stock

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-

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7,099

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ComSIT Distribution GmbH

Germany . 562 parts In-Stock

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562

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LIBRA Elektronik GmbH

Germany . 13 parts In-Stock

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13

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Elcom Components

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,444 parts In-Stock

1+ parts

$11.709

100+ parts

-

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1,444

$11.709

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Microchip USA

USA . 3,389 parts In-Stock

1+ parts

$19.704

100+ parts

-

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3,389

$19.704

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Parana Technologies

USA . 13 parts In-Stock

1+ parts

$32.196

100+ parts

-

1k+ parts

$101.037

10k+ parts

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13

$32.196

-

$101.037

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DigiPath Technology Company

USA . 591 parts In-Stock

1+ parts

$35.452

100+ parts

$32.615

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-

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591

$35.452

$32.615

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IDEA Electronic Components Group

UK . 1,309 parts In-Stock

1+ parts

$36.175

100+ parts

$34.366

1k+ parts

$32.558

10k+ parts

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1,309

$36.175

$34.366

$32.558

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ChromeModa Solutions

Germany . 1,288 parts In-Stock

1+ parts

$36.175

100+ parts

$29.664

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1,288

$36.175

$29.664

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Epart123

USA . 8,000 parts In-Stock

1+ parts

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$3.600

10k+ parts

$3.600

8,000

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$3.600

$3.600

Lixinc

USA . 6,707 parts In-Stock

1+ parts

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6,707

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Perfect Parts

USA . 5,896 parts In-Stock

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5,896

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A-Z Elektronik GmbH

Germany . 5,834 parts In-Stock

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5,834

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Kepictronics

USA . 3,005 parts In-Stock

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3,005

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of seamless communication with the TL16C554AIPNR by Texas Instruments. Designed with precision and expertise, this Serial Communication Controller offers unparalleled reliability and performance. Ideal for a wide range of applications, it provides fast and efficient data transfer rates without compromising on quality. Experience the convenience and ease of use this product brings, making it a valuable addition to any project. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for greater flexibility in powering the device, accommodating a range of power sources without risking damage to the controller.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate ensures fast and efficient communication between devices, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C makes this controller suitable for use in various environmental conditions, providing reliable performance in extreme temperatures.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level data transfer allows for flexibility in implementing different communication protocols, making it compatible with a wide range of systems and devices.

Technical Specifications

Serial Communication Controllers TL16C554AIPNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TL16C554AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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