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TL16C552AFNRG4

Texas Instruments

TL16C552AFNRG4 by Texas Instruments

TL16C552AFNRG4 by Texas Instruments is a Serial Communication Controller with 5V power supply, 16MHz clock frequency, and 0.125 MBps data transfer rate. It is used in IBM PC-AT for asynchronous communication at temperatures ranging from 0 to 70°C.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,238 parts In-Stock

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Digiode

USA . 4,716 parts In-Stock

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Chip Stock

USA . 625 parts In-Stock

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625

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Bristol Electronics

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One Stop Electronics

USA . 843 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 582 parts In-Stock

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Parana Technologies

USA . 883 parts In-Stock

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DigiPath Technology Company

USA . 2,294 parts In-Stock

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ChromeModa Solutions

Germany . 4,565 parts In-Stock

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IDEA Electronic Components Group

UK . 721 parts In-Stock

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Corphita

USA . 4,542 parts In-Stock

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Microchip USA

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Overview

Experience seamless and efficient serial communication with the TL16C552AFNRG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The TL16C552AFNRG4 is perfect for a wide range of applications in the serial communication controllers category. With its reliable performance and advanced features, this product provides undeniable value to customers by offering unmatched benefits and advantages. Upgrade your system today with the TL16C552AFNRG4 and experience enhanced communication capabilities like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to harsh environmental conditions.

Surface Mount: YES

Allows for easy placement and soldering onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can operate safely within a wide range of voltage inputs, making it versatile for different applications.

Address Bus Width: 3

Having a wider address bus width allows for efficient communication and data transfer within the system.

Package Shape: SQUARE

Square shape enables easy integration into various circuit designs and layouts.

Power Supplies (V): 5

Operates efficiently at the standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 68

Sufficient number of terminals for connecting with other components and peripherals, enhancing connectivity options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and efficient heat dissipation for improved performance.

Minimum Supply Voltage: 4.75 V

Can still function reliably even with slightly lower voltage inputs, ensuring stability in varying power conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows for use in demanding industrial environments without overheating issues.

Maximum Data Transfer Rate: 0.125 MBps

Capable of fast data transfer rates, making it suitable for high-speed communication requirements.

Minimum Operating Temperature: 0 °C

Can operate in colder environments without affecting performance, expanding its usability in diverse settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold finish provides excellent conductivity, corrosion resistance, and longevity for prolonged usage.

Terminal Position: QUAD

Quad terminal position facilitates secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 4.57 mm

Low seated height enhances compactness and space-saving design when integrated into a system.

Width: 24.23 mm

Moderate width size allows for easy placement on a PCB and compatibility with standard spacing requirements.

External Data Bus Width: 8

Wide external data bus width enables efficient data transmission and processing for seamless operations.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level data transfer, catering to a variety of communication needs.

Maximum Clock Frequency: 16 MHz

High clock frequency capability enables rapid data processing and handling for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures proper soldering and connection integrity during assembly.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperatures during manufacturing processes, ensuring reliability and durability.

Length: 24.23 mm

Optimal length size for easy integration and fitting within a circuit layout or enclosure.

Temperature Grade: COMMERCIAL

Designed for commercial use with reliable performance under standard temperature conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Features serial I/O and communication functionalities, offering versatile connectivity options for various devices and systems.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and reliable operation in different environments.

Terminal Form: J BEND

J-bend terminal form provides secure mounting and reliable electrical connections for stable data transmission.

Nominal Supply Voltage: 5 V

Operates efficiently at the nominal voltage, ensuring stable performance and compatibility with standard power sources.

No. of Serial I/Os: 2

Multiple serial I/Os allow for versatile connectivity options and simultaneous data transfer capabilities.

Bus Compatibility: IBM PC-AT

Compatible with IBM PC-AT bus systems, ensuring seamless integration and communication with standard computer architectures.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connection with other components, facilitating assembly and installation.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Serial Communication Controllers TL16C552AFNRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552AFNRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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