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TL16C552AFNG4

Texas Instruments

TL16C552AFNG4 by Texas Instruments

TL16C552AFNG4 by Texas Instruments is a Serial Communication Controller with 5V supply, 0-70°C operating temp, and 0.125 MBps data transfer rate. It is used in IBM PC-AT for asynchronous communication at 16 MHz clock frequency.

Median Price

$7.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 494 parts In-Stock

1+ parts

-

100+ parts

$7.610

1k+ parts

$6.810

10k+ parts

$6.410

494

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$7.610

$6.810

$6.410

DigiKey

USA . 338 parts In-Stock

1+ parts

-

100+ parts

$6.470

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338

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$6.470

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Verical

USA . 156 parts In-Stock

1+ parts

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100+ parts

$9.512

1k+ parts

$8.512

10k+ parts

$8.012

156

-

$9.512

$8.512

$8.012

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,260 parts In-Stock

1+ parts

$5.909

100+ parts

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4,260

$5.909

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Vyrian

USA . 3,078 parts In-Stock

1+ parts

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3,078

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ACDS - Activité Composants Distribution Service

France . 41 parts In-Stock

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41

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Bristol Electronics

USA . 41 parts In-Stock

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,476 parts In-Stock

1+ parts

$5.598

100+ parts

-

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3,476

$5.598

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Parana Technologies

USA . 1,020 parts In-Stock

1+ parts

$48.967

100+ parts

-

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1,020

$48.967

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DigiPath Technology Company

USA . 823 parts In-Stock

1+ parts

$53.919

100+ parts

$49.605

1k+ parts

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823

$53.919

$49.605

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ChromeModa Solutions

Germany . 4,744 parts In-Stock

1+ parts

$55.019

100+ parts

$45.116

1k+ parts

-

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4,744

$55.019

$45.116

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$55.019

100+ parts

$52.268

1k+ parts

$49.517

10k+ parts

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742

$55.019

$52.268

$49.517

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Microchip USA

USA . 1,327 parts In-Stock

1+ parts

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1,327

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Enhance your communication systems with the TL16C552AFNG4 by Texas Instruments, a top-notch Serial Communication Controller designed for seamless and efficient data transfer. Manufactured with precision and expertise, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this controller is a valuable asset for any tech-savvy customer looking to optimize their systems. Trust Texas Instruments to deliver cutting-edge solutions that elevate your technology to the next level. Elevate your connectivity with the TL16C552AFNG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The PLASTIC/EPOXY material used for the package body is durable and lightweight, making the product suitable for a variety of applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V provides flexibility in power supply options and ensures reliable performance under varying voltage conditions.

Address Bus Width: 3

The 3-bit address bus width allows for compatibility with various memory configurations and efficient data transfer within the system.

Package Shape: SQUARE

The square package shape is compact and efficient, maximizing space utilization on the circuit board and enabling easy integration into existing designs.

Power Supplies (V): 5

The standard 5V power supply requirement makes the product compatible with a wide range of power sources, simplifying integration into different systems.

No. of Terminals: 68

The 68 terminals provide ample connectivity options for various peripherals and interfaces, allowing for versatile and flexible system configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and reliability, making it suitable for high-speed communication applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V ensures stable operation even under low-power conditions, making the product efficient and reliable.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable performance in harsh environmental conditions, ensuring long-term durability.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps enables fast and efficient communication, making the product ideal for high-speed data processing applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance in cold environments, making the product suitable for various industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The NICKEL PALLADIUM GOLD terminal finish provides excellent corrosion resistance and conductivity, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

The quad terminal position enables efficient signal routing and connectivity, optimizing space utilization on the circuit board and simplifying installation.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm allows for compact and space-saving designs, making the product suitable for applications with limited space constraints.

Width: 24.23 mm

The width of 24.23 mm provides a balance between compactness and connectivity options, making the product versatile and suitable for diverse system designs.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data transfer and processing, enhancing system performance and speed.

Communication Protocol: ASYNC, BIT

The asynchronous and bit-level communication protocols offer flexibility and compatibility with a wide range of devices and systems, making the product versatile and easy to integrate.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz ensures fast and reliable data processing, making the product suitable for real-time applications and high-speed communication.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and thermal performance during manufacturing processes, enhancing product reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering of the product, ensuring secure connections and long-term performance.

Length: 24.23 mm

The length of 24.23 mm provides a compact form factor, making the product suitable for space-constrained applications without compromising on performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making the product suitable for a wide range of commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The serial IO and communication controller design facilitates seamless communication between devices and systems, making the product versatile and interoperable.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance in various environments.

Terminal Form: J BEND

The J BEND terminal form allows for easy and secure connections, reducing the risk of signal interference and ensuring reliable data transmission.

Maximum Supply Current: 50 mA

The low maximum supply current of 50 mA minimizes power consumption and heat generation, making the product energy-efficient and suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems and designs.

No. of Serial I/Os: 2

The 2 serial I/Os provide multiple connectivity options for data exchange and communication, enhancing system flexibility and enabling diverse applications.

Bus Compatibility: IBM PC-AT

The IBM PC-AT bus compatibility allows for seamless integration with standard PC architectures, ensuring interoperability and easy adoption in PC-based systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides ample space for solder connections and signal routing, ensuring secure and reliable connections for data transfer.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, making the product suitable for a range of storage and operating conditions without compromising performance.

Technical Specifications

Serial Communication Controllers TL16C552AFNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552AFNG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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