Loading...

TL16C550DPFBG4

Texas Instruments

TL16C550DPFBG4 by Texas Instruments

TL16C550DPFBG4 by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 24 MHz clock frequency. It supports data transfer rate of 0.1875 MBps and communication protocols like ASYNC and BIT. Ideal for applications requiring high-speed serial communication in commercial temperature grades.

Median Price

$2.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$2.640

1k+ parts

$2.360

10k+ parts

$2.220

68

-

$2.640

$2.360

$2.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,337 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,337

$3.040

-

-

-

Vyrian

USA . 2,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,344

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,658 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

4,658

$2.880

-

-

-

AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$10.090

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$10.090

-

-

-

Parana Technologies

USA . 91 parts In-Stock

1+ parts

$57.617

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$57.617

-

-

-

DigiPath Technology Company

USA . 1,621 parts In-Stock

1+ parts

$63.443

100+ parts

$58.368

1k+ parts

-

10k+ parts

-

1,621

$63.443

$58.368

-

-

ChromeModa Solutions

Germany . 6,622 parts In-Stock

1+ parts

$64.738

100+ parts

$53.085

1k+ parts

-

10k+ parts

-

6,622

$64.738

$53.085

-

-

IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$64.738

100+ parts

$61.501

1k+ parts

$58.264

10k+ parts

-

2,369

$64.738

$61.501

$58.264

-

Microchip USA

USA . 1,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,659

-

-

-

-

Overview

Upgrade your communication systems with the TL16C550DPFBG4 by Texas Instruments. As a leading manufacturer in serial communication controllers, Texas Instruments delivers top-notch quality and reliability. This versatile device is perfect for various applications, offering seamless data transfer and high-speed performance. With a wide supply voltage range and advanced technology, this product provides exceptional value and benefits to customers looking to enhance their communication capabilities. Trust Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 3

The address bus width of 3 enhances the data processing capabilities and efficiency of the communication controller.

Package Shape: SQUARE

Square package shape facilitates uniform and compact placement within electronic devices, optimizing space utilization.

Power Supplies (V): 2.5/5

The dual power supply options of 2.5V and 5V provide versatility for different operational requirements and power sources.

No. of Terminals: 48

The ample number of terminals allows for versatile connectivity and efficient signal transmission in various applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package styles offers space-saving design, high density integration, and improved signal performance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with different power sources and efficient operation at lower power levels.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C enables reliable performance in various environmental conditions.

Maximum Data Transfer Rate: 0.1875 MBps

The high data transfer rate allows for fast and efficient communication, making the product suitable for high-speed applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures functionality even in colder climates or environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: QUAD

Quad terminal position enhances stability, connectivity, and signal transmission efficiency in the communication controller.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for compact and efficient board layout and integration in electronic systems.

Width: 7 mm

The compact width of 7 mm contributes to space-saving design and efficient placement in electronic devices.

External Data Bus Width: 8

The external data bus width of 8 enhances data processing speed and efficiency in the communication controller.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocols enables flexible and efficient data transfer in various systems.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz allows for fast and real-time data processing and communication in the controller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and reliable soldering during the assembly process.

Length: 7 mm

The compact length of 7 mm contributes to a space-efficient design and easy integration within electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, making the product suitable for commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type with serial IO and communication controller functionality offers versatile connectivity and efficient data transfer capabilities.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable performance in the communication controller.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure and reliable soldering connections, enhancing the operational stability of the communication controller.

Maximum Supply Current: 8 mA

The low maximum supply current of 8 mA ensures energy efficiency and stable operation of the communication controller.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and stable performance in various applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density integration, precise connections, and efficient signal transmission within electronic systems.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture exposure, requiring standard handling and storage practices to maintain product integrity.

Technical Specifications

Serial Communication Controllers TL16C550DPFBG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TL16C550DPFBG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 21