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TL16C2752FNR

Texas Instruments

TL16C2752FNR by Texas Instruments

TL16C2752FNR by Texas Instruments is a Serial Communication Controller with 44 terminals, operating at 0-70°C. It supports data transfer rates up to 0.375 MBps and features a max clock frequency of 48 MHz. Ideal for applications requiring high-speed asynchronous communication in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,578 parts In-Stock

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8,578

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Digiode

USA . 2,129 parts In-Stock

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2,129

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Distributors (Availability)

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$8.460

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723

$8.460

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One Stop Electronics

USA . 1,501 parts In-Stock

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$20.000

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1,501

$20.000

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Parana Technologies

USA . 1,207 parts In-Stock

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$29.181

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$56.491

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1,207

$29.181

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$56.491

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DigiPath Technology Company

USA . 816 parts In-Stock

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$32.132

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816

$32.132

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ChromeModa Solutions

Germany . 5,168 parts In-Stock

1+ parts

$32.788

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$26.886

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5,168

$32.788

$26.886

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IDEA Electronic Components Group

UK . 841 parts In-Stock

1+ parts

$32.788

100+ parts

$31.149

1k+ parts

$29.509

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841

$32.788

$31.149

$29.509

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Corphita

USA . 3,466 parts In-Stock

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Microchip USA

USA . 1,632 parts In-Stock

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Overview

Unleash the power of seamless communication with the TL16C2752FNR by Texas Instruments. Crafted with precision and expertise, this Serial Communication Controller is designed to elevate your projects to the next level. Whether you're in the automotive industry, telecommunications, or IoT devices, this versatile chip carrier package offers unparalleled performance and reliability. With a wide operating temperature range, high data transfer rate, and multiple serial I/Os, this cutting-edge technology ensures that your systems run smoothly and efficiently. Trust Texas Instruments for quality, innovation, and excellence in every product they deliver. Elevate your communication game with the TL16C2752FNR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, it allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Can operate within a wide range of supply voltages, providing flexibility in various applications.

Package Shape: SQUARE

Square packages are space-efficient and suitable for densely populated PCB designs.

Maximum Operating Temperature: 70 °C

Capable of operating at high temperatures without compromising performance.

Maximum Data Transfer Rate: 0.375 MBps

Offers high-speed data transfer capabilities for efficient communication.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level data transfer for versatile connectivity options.

Maximum Clock Frequency: 48 MHz

High clock frequency allows for fast data processing and communication speeds.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall product efficiency.

Technical Specifications

Serial Communication Controllers TL16C2752FNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C2752FNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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