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TISP4125F3DR

Texas Instruments

TISP4125F3DR by Texas Instruments

TISP4125F3DR by Texas Instruments is a single silicon surge protector with 4A non-repetitive peak on-state current. It has a max breakdown voltage of 125V and operates b/w 0-70°C. Ideal for protecting electronic devices from voltage surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 47,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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47,500

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ComSIT Distribution GmbH

Germany . 42,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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42,500

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ComSIT USA

USA . 42,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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42,500

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-

-

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Vyrian

USA . 4,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,729

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-

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Digiode

USA . 3,519 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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3,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 345 parts In-Stock

1+ parts

$2.279

100+ parts

-

1k+ parts

$2.779

10k+ parts

-

345

$2.279

-

$2.779

-

DigiPath Technology Company

USA . 1,060 parts In-Stock

1+ parts

$2.510

100+ parts

$2.309

1k+ parts

-

10k+ parts

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1,060

$2.510

$2.309

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ChromeModa Solutions

Germany . 4,850 parts In-Stock

1+ parts

$2.561

100+ parts

$2.100

1k+ parts

-

10k+ parts

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4,850

$2.561

$2.100

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IDEA Electronic Components Group

UK . 2,370 parts In-Stock

1+ parts

$2.561

100+ parts

-

1k+ parts

$2.305

10k+ parts

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2,370

$2.561

-

$2.305

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One Stop Electronics

USA . 327 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

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10k+ parts

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327

$13.100

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$18.834

100+ parts

-

1k+ parts

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10k+ parts

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344

$18.834

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Kepictronics

USA . 32,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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32,000

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Corphita

USA . 3,133 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,133

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Overview

Protect your valuable electronic devices with the TISP4125F3DR by Texas Instruments, a top-of-the-line silicon surge protector. Manufactured by industry leader Texas Instruments, this single configuration protector offers unmatched quality and reliability. Ideal for applications where protection against voltage surges is crucial, this product ensures peace of mind and prolongs the lifespan of your equipment. Trust Texas Instruments to deliver superior performance and safeguard your investments with the TISP4125F3DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the surge protector.

Configuration: SINGLE

Simplifies installation and usage, making it easy to set up and operate.

Non Repetitive Peak On-state Current: 4 A

Ability to handle high current surges, providing reliable protection for connected devices.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Allows for a compact design, making it suitable for various applications where space is limited.

Terminal Form: GULL WING

Facilitates soldering process during installation, ensuring secure connections for optimal performance.

No. of Terminals: 8

Provides flexibility for connecting additional components or devices, enhancing the functionality of the surge protector.

Package Style (Meter): SMALL OUTLINE

Contributes to a neat and organized setup, especially in tight spaces or crowded circuit boards.

Maximum DC Off-state Voltage: 100 V

Offers protection against voltage spikes and surges, safeguarding connected equipment from potential damage.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Trigger Device Type: SILICON SURGE PROTECTOR

Utilizes advanced technology to quickly divert excess voltage away from connected devices, providing effective surge protection.

Minimum Operating Temperature: 0 °C

Designed to operate efficiently in low-temperature settings, ensuring consistent performance regardless of environmental conditions.

Terminal Position: DUAL

Allows for versatile installation options, accommodating various wiring configurations for convenient setup.

Maximum Breakdown Voltage: 125 V

Provides a safety margin above the maximum operating voltage, offering added protection against unexpected voltage spikes.

Reference Standard: UL RECOGNIZED

Complies with industry standards for safety and performance, giving users peace of mind when using the surge protector.

Technical Specifications

Silicon Surge Protectors TISP4125F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Configuration:

Maximum DC Off-state Voltage:

100 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4125F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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