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TISP3290H3SL

Texas Instruments

TISP3290H3SL by Texas Instruments

TISP3290H3SL by Texas Instruments is a Silicon Surge Protector with 60A peak current, 220V off-state voltage, and 290V breakdown voltage. It is used for surge protection in various applications due to its thyristor trigger device type and series-connected configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,120 parts In-Stock

1+ parts

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5,120

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Digiode

USA . 4,212 parts In-Stock

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4,212

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Legend Electronics Inc.

USA . 3,373 parts In-Stock

1+ parts

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3,373

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,027 parts In-Stock

1+ parts

$1.100

100+ parts

-

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1,027

$1.100

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Parana Technologies

USA . 553 parts In-Stock

1+ parts

$4.177

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$4.619

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553

$4.177

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$4.619

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IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$4.693

100+ parts

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$4.224

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2,312

$4.693

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$4.224

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ChromeModa Solutions

Germany . 521 parts In-Stock

1+ parts

$4.693

100+ parts

$3.848

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521

$4.693

$3.848

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AZTECH Wire

Italy . 491 parts In-Stock

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$17.938

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491

$17.938

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Corphita

USA . 2,632 parts In-Stock

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2,632

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DigiPath Technology Company

USA . 2,032 parts In-Stock

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$4.231

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2,032

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$4.231

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Overview

Protect your valuable electronics with the TISP3290H3SL by Texas Instruments, a top-tier manufacturer known for its quality products. As a silicon surge protector, this device offers superior protection against voltage spikes and surges, ensuring the safety and longevity of your devices. With a maximum breakdown voltage of 290V and a non-repetitive peak on-state current of 60A, this surge protector is ideal for a wide range of applications. Trust in Texas Instruments to deliver reliable and durable solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the surge protector, ensuring durability and safety.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration helps in evenly distributing the surge protection across the connected devices, offering effective protection.

Non Repetitive Peak On-state Current: 60 A

Can handle high surge currents, making it suitable for protecting electronic devices from sudden voltage spikes.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it reliable in various operating conditions.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Featuring a thyristor surge protector ensures quick response to transient overvoltage conditions, effectively protecting connected equipment.

Technical Specifications

Silicon Surge Protectors TISP3290H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

290 V

Maximum DC Off-state Voltage:

220 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3290H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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