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TISP3290F3P

Texas Instruments

TISP3290F3P by Texas Instruments

TISP3290F3P by Texas Instruments is a Silicon Surge Protector with 6A Non Repetitive Peak On-state Current and 290V Max Breakdown Voltage. It features SERIES CONNECTED, CENTER TAP configuration for surge protection in power supply units and telecommunication equipment. The THYRISTOR SURGE PROTECTOR is UL RECOGNIZED, ideal for safeguarding against voltage spikes in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,839 parts In-Stock

1+ parts

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7,839

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Digiode

USA . 1,518 parts In-Stock

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1,518

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 660 parts In-Stock

1+ parts

$0.100

100+ parts

$0.098

1k+ parts

$0.097

10k+ parts

-

660

$0.100

$0.098

$0.097

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Ampacity Inc.

Singapore . 544 parts In-Stock

1+ parts

$0.100

100+ parts

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544

$0.100

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Parana Technologies

USA . 1,902 parts In-Stock

1+ parts

$3.601

100+ parts

-

1k+ parts

$4.118

10k+ parts

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1,902

$3.601

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$4.118

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DigiPath Technology Company

USA . 1,571 parts In-Stock

1+ parts

$3.965

100+ parts

$3.648

1k+ parts

-

10k+ parts

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1,571

$3.965

$3.648

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ChromeModa Solutions

Germany . 3,715 parts In-Stock

1+ parts

$4.046

100+ parts

$3.318

1k+ parts

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3,715

$4.046

$3.318

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$4.046

100+ parts

-

1k+ parts

$3.641

10k+ parts

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777

$4.046

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$3.641

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One Stop Electronics

USA . 1,215 parts In-Stock

1+ parts

$6.100

100+ parts

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1,215

$6.100

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$15.450

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820

$15.450

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Corphita

USA . 3,389 parts In-Stock

1+ parts

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3,389

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Corohmni

South Africa . 82 parts In-Stock

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82

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Overview

Protect your valuable electronic devices with the TISP3290F3P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that are reliable and durable. The TISP3290F3P is a Silicon Surge Protector designed to safeguard against voltage spikes, ensuring the longevity of your equipment. With a series connected, center tap configuration, this surge protector offers superior protection with a maximum breakdown voltage of 290V. Trust Texas Instruments for all your surge protection needs and keep your devices safe and secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the surge protector.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration allows for efficient surge protection by having multiple elements connected in series, with a center tap for enhanced performance.

Non Repetitive Peak On-state Current: 6 A

The high peak on-state current rating of 6A ensures that the surge protector can handle sudden spikes in electrical current effectively.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and compatibility with standard electrical equipment.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides reliable and secure connections for the surge protector.

Maximum DC Off-state Voltage: 200 V

The high maximum DC off-state voltage rating of 200V ensures that the surge protector can protect against a wide range of electrical surges.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of a thyristor surge protector as the trigger device ensures fast and efficient response to surge events.

Maximum Breakdown Voltage: 290 V

The high maximum breakdown voltage rating of 290V ensures that the surge protector can handle high voltage spikes effectively.

Reference Standard: UL RECOGNIZED

Being UL recognized indicates that the surge protector meets safety and performance standards set by Underwriters Laboratories.

Technical Specifications

Silicon Surge Protectors TISP3290F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

290 V

Maximum DC Off-state Voltage:

200 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3290F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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