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TISP3150F3D

Texas Instruments

TISP3150F3D by Texas Instruments

TISP3150F3D by Texas Instruments is a Silicon Surge Protector with 4A Non Repetitive Peak On-state Current. It features SERIES CONNECTED, CENTER TAP configuration and 120V Max DC Off-state Voltage. Ideal for protecting electronic devices from voltage surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,497 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,497

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,715 parts In-Stock

1+ parts

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1,715

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Vyrian

USA . 1,233 parts In-Stock

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1,233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,270 parts In-Stock

1+ parts

$2.966

100+ parts

-

1k+ parts

$3.468

10k+ parts

-

1,270

$2.966

-

$3.468

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DigiPath Technology Company

USA . 1,915 parts In-Stock

1+ parts

$3.266

100+ parts

$3.005

1k+ parts

-

10k+ parts

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1,915

$3.266

$3.005

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ChromeModa Solutions

Germany . 1,913 parts In-Stock

1+ parts

$3.333

100+ parts

$2.733

1k+ parts

-

10k+ parts

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1,913

$3.333

$2.733

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IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$3.333

100+ parts

-

1k+ parts

$3.000

10k+ parts

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620

$3.333

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$3.000

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One Stop Electronics

USA . 1,030 parts In-Stock

1+ parts

$10.100

100+ parts

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1k+ parts

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1,030

$10.100

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AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$11.861

100+ parts

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1k+ parts

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805

$11.861

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Corphita

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Overview

Experience peace of mind with the TISP3150F3D by Texas Instruments, a top-quality Silicon Surge Protector designed to safeguard your valuable electronics from power surges. With its series-connected, center tap configuration and non-repetitive peak on-state current of 4A, this device offers superior protection against voltage spikes. Whether you're looking to protect your home appliances or industrial equipment, this UL recognized product provides reliable performance and peace of mind. Trust Texas Instruments for cutting-edge technology that ensures your devices stay safe and operational.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the surge protector, ensuring a longer lifespan.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with center tap and 2 elements allows for effective surge protection and efficient operation.

Non Repetitive Peak On-state Current: 4 A

The high peak on-state current capability ensures that the surge protector can handle sudden surges effectively.

Surface Mount: YES

Being surface mountable makes installation easy and convenient, especially in compact spaces.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in various electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ensures reliable performance of the surge protector.

Maximum DC Off-state Voltage: 120 V

With a high off-state voltage rating, this surge protector can effectively handle and suppress voltage spikes up to 120V.

Trigger Device Type: SILICON SURGE PROTECTOR

Silicon surge protectors are known for their high-performance and reliability in suppressing surges, making this product a dependable choice.

Maximum Breakdown Voltage: 150 V

The high breakdown voltage rating ensures that the surge protector can withstand and suppress surges up to 150V effectively.

Reference Standard: UL RECOGNIZED

Being UL recognized indicates that this surge protector meets safety and performance standards, providing assurance of quality and reliability.

Technical Specifications

Silicon Surge Protectors TISP3150F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

150 V

Maximum DC Off-state Voltage:

120 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3150F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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