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TISP2082L

Texas Instruments

TISP2082L by Texas Instruments

TISP2082L by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a max breakdown voltage of 82V and can handle a non-repetitive peak on-state current of 10A. This rectangular package with through-hole terminals is ideal for surge protection applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,602 parts In-Stock

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Digiode

USA . 972 parts In-Stock

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972

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 285 parts In-Stock

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285

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Pegasus Components GmbH

Germany . 77 parts In-Stock

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77

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,304 parts In-Stock

1+ parts

$3.633

100+ parts

$337.377

1k+ parts

$3.270

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2,304

$3.633

$337.377

$3.270

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$4.000

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2,009

$4.000

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ChromeModa Solutions

Germany . 6,146 parts In-Stock

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$4.082

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$3.347

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6,146

$4.082

$3.347

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IDEA Electronic Components Group

UK . 2,040 parts In-Stock

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$4.082

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$3.674

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2,040

$4.082

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$3.674

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AZTECH Wire

Italy . 709 parts In-Stock

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$12.698

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709

$12.698

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One Stop Electronics

USA . 466 parts In-Stock

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$20.100

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466

$20.100

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Corphita

USA . 4,895 parts In-Stock

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Overview

With the Texas Instruments TISP2082L Silicon Surge Protector, you can trust in the quality and reliability that comes from a leading manufacturer in the industry. Designed with three elements in a delta connected configuration, this device offers superior protection against voltage spikes. Whether you're safeguarding sensitive electronics or industrial equipment, the TISP2082L provides peace of mind with its 10A non-repetitive peak on-state current and maximum breakdown voltage of 82V. Invest in the best with Texas Instruments and keep your valuable assets safe.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the surge protector, ensuring a long lifespan and reliable performance.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements enhances the surge protection capability of the device, offering robust defense against power surges.

Non Repetitive Peak On-state Current: 10 A

The high peak on-state current of 10 A allows the surge protector to effectively handle sudden spikes in electrical current, safeguarding connected devices.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to install and fit into different electronic setups, providing versatility in usage.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and stable connection points, reducing the risk of loose connections during operation.

Maximum Breakdown Voltage: 82 V

The high maximum breakdown voltage of 82 V offers superior protection against voltage spikes, effectively shielding electronic devices from potential damage.

Technical Specifications

Silicon Surge Protectors TISP2082L attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

82 V

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

10 A

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2082L Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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