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TISP3070H3SL

Texas Instruments

TISP3070H3SL by Texas Instruments

TISP3070H3SL by Texas Instruments is a silicon surge protector with 60A peak current, 58V off-state voltage, and 70V breakdown voltage. It is used for surge protection in various applications due to its thyristor trigger device type and series-connected configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,888 parts In-Stock

1+ parts

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4,888

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Vyrian

USA . 3,463 parts In-Stock

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3,463

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 130 parts In-Stock

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130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 900 parts In-Stock

1+ parts

$1.971

100+ parts

$183.070

1k+ parts

$1.774

10k+ parts

-

900

$1.971

$183.070

$1.774

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DigiPath Technology Company

USA . 59 parts In-Stock

1+ parts

$2.171

100+ parts

$1.997

1k+ parts

-

10k+ parts

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59

$2.171

$1.997

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ChromeModa Solutions

Germany . 5,605 parts In-Stock

1+ parts

$2.215

100+ parts

$1.816

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-

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5,605

$2.215

$1.816

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$2.215

100+ parts

-

1k+ parts

$1.994

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2,012

$2.215

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$1.994

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AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$10.746

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463

$10.746

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One Stop Electronics

USA . 1,506 parts In-Stock

1+ parts

$15.100

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1,506

$15.100

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Component Stockers USA

USA . 253 parts In-Stock

1+ parts

$99.990

100+ parts

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253

$99.990

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Corphita

USA . 2,340 parts In-Stock

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2,340

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance the safety and reliability of your electronic devices with the TISP3070H3SL from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality silicon surge protectors designed to safeguard your equipment against voltage spikes and power surges. Whether you're looking to protect telecommunications equipment, industrial control systems, or consumer electronics, this series-connected, center tap device offers superior performance and peace of mind. Trust Texas Instruments for exceptional protection and unmatched quality in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the surge protector, making it ideal for long-term use.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with center tap and 2 elements ensures efficient distribution of current and effective protection against power surges.

Non Repetitive Peak On-state Current: 60 A

With a high non repetitive peak on-state current of 60 A, this surge protector is capable of handling sudden surges in power without damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and space-saving placement of the surge protector in various electronic devices.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type ensures rapid response to power surges, effectively protecting connected devices from voltage spikes.

Technical Specifications

Silicon Surge Protectors TISP3070H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

70 V

Maximum DC Off-state Voltage:

58 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3070H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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