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TIED98

Texas Instruments

TIED98 by Texas Instruments

TIED98 by Texas Instruments is a photodiode with max operating temp of 125°C, min operating temp of -60°C, and max dark current of 10nA. It has a response time of 45ns and can handle up to 50V reverse voltage. Ideal for light sensing applications due to its silicon semiconductor material and through hole mounting feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,482 parts In-Stock

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7,482

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Digiode

USA . 2,046 parts In-Stock

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2,046

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 182 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

$1.431

10k+ parts

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182

$0.054

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$1.431

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DigiPath Technology Company

USA . 684 parts In-Stock

1+ parts

$0.060

100+ parts

$0.055

1k+ parts

-

10k+ parts

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684

$0.060

$0.055

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ChromeModa Solutions

Germany . 3,716 parts In-Stock

1+ parts

$0.061

100+ parts

$0.050

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3,716

$0.061

$0.050

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IDEA Electronic Components Group

UK . 928 parts In-Stock

1+ parts

$0.061

100+ parts

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$0.055

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928

$0.061

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$0.055

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Semicontronic

India . 653 parts In-Stock

1+ parts

$4.100

100+ parts

$3.998

1k+ parts

$3.977

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653

$4.100

$3.998

$3.977

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AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$5.026

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464

$5.026

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One Stop Electronics

USA . 910 parts In-Stock

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$10.100

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910

$10.100

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Ampacity Inc.

Singapore . 1,035 parts In-Stock

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$20.100

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1,035

$20.100

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Corphita

USA . 1,560 parts In-Stock

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1,560

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Corohmni

South Africa . 263 parts In-Stock

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263

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Overview

Experience unparalleled quality and reliability with the TIED98 photodiode by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. The TIED98 is perfect for a wide range of applications, offering fast response times and precise measurements. Trust in Texas Instruments to deliver value and innovation with every product, providing you with the competitive edge you need.

Feature Benefit Bullets

Maximum Operating Temperature: 125 °C

This high maximum operating temperature allows the photodiode to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -60 °C

With a low minimum operating temperature, this photodiode can be used in cold environments without any performance issues.

Maximum Dark Current: 10 nA

The low dark current ensures that the photodiode produces accurate and reliable measurements, especially in low light conditions.

Maximum Response Time: 0.000000045 s

The fast response time of this photodiode allows it to quickly react to changes in light intensity, making it suitable for high-speed applications.

Maximum Reverse Voltage: 50 V

With a maximum reverse voltage of 50V, this photodiode offers protection against potential damage from reverse polarity or overvoltage conditions.

Semiconductor Material: Silicon

Silicon photodiodes are known for their high sensitivity to light and low noise levels, making them ideal for a wide range of light detection applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature makes it easy to securely install and connect the photodiode to a circuit board, ensuring stable and reliable performance.

Technical Specifications

Photodiodes TIED98 attributes and parameters. Explore more Photodiodes devices from Texas Instruments

Specs

Maximum Dark Current:

10 nA

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-60 Cel

Maximum Response Time:

.000000045 s

Maximum Reverse Voltage:

50 V

Semiconductor Material:

Silicon

Sub-Category:

Photo Diodes

Trade Compliance

TIED98 Optoelectronics trade compliance attributes, and parameters.

ECCN

3A001.A.2.B

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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