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THS7315DG4

Texas Instruments

THS7315DG4 by Texas Instruments

THS7315DG4 by Texas Instruments is a video amplifier with 3 channels, BICMOS technology, and 10.6 kHz bandwidth. It operates at -40 to 85°C, with supply voltage ranging from 3V to 5V. Ideal for audio/video applications requiring small outline packages in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,767 parts In-Stock

1+ parts

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7,767

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Digiode

USA . 2,992 parts In-Stock

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2,992

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Euro-Tech

UK . 2,490 parts In-Stock

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2,490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 426 parts In-Stock

1+ parts

$1.221

100+ parts

-

1k+ parts

$2.009

10k+ parts

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426

$1.221

-

$2.009

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ChromeModa Solutions

Germany . 2,854 parts In-Stock

1+ parts

$1.372

100+ parts

$1.125

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2,854

$1.372

$1.125

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IDEA Electronic Components Group

UK . 690 parts In-Stock

1+ parts

$1.372

100+ parts

-

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$1.235

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690

$1.372

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$1.235

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One Stop Electronics

USA . 1,450 parts In-Stock

1+ parts

$4.800

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1,450

$4.800

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AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$11.113

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349

$11.113

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Corphita

USA . 4,265 parts In-Stock

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4,265

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DigiPath Technology Company

USA . 603 parts In-Stock

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$1.237

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603

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$1.237

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Overview

Looking to enhance your audio and video experience? Look no further than the THS7315DG4 by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers top-notch performance in the Audio & Video Amplifiers category. This compact and versatile video amplifier offers customers exceptional value with its advanced technology and wide range of applications. Elevate your viewing and listening experience with the THS7315DG4 - the perfect choice for all your audio and video needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and protection for the internal components of the amplifier, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology makes it easier to mount the amplifier on a circuit board, saving space and making it more convenient for assembly.

No. of Terminals: 8

Having 8 terminals allows for more flexibility in connecting various components and ensures compatibility with different circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this amplifier suitable for use in various environments, including cold climates.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high speed and low power consumption for improved performance.

Nominal Bandwidth: 10.6 kHz

A nominal bandwidth of 10.6 kHz ensures that the amplifier can handle a wide range of audio or video signals, making it versatile for different applications.

Moisture Sensitivity Level (MSL): 2

A moisture sensitivity level of 2 indicates that the amplifier is resistant to moisture damage, making it suitable for use in humid environments or during soldering processes.

Technical Specifications

Audio & Video Amplifiers THS7315DG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

10.6 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

THS7315DG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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