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THS7303PWRG4

Texas Instruments

THS7303PWRG4 by Texas Instruments

THS7303PWRG4 by Texas Instruments is a BICMOS video amplifier with 3 channels, gain of 6 dB, and nominal bandwidth of 41 kHz. It operates at industrial temperature grade (-40 to 85 °C) with power supplies ranging from 2.7V to 5V. Ideal for audio/video applications requiring high performance in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,008

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-

-

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Digiode

USA . 977 parts In-Stock

1+ parts

-

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-

1k+ parts

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977

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,361 parts In-Stock

1+ parts

$2.245

100+ parts

$208.526

1k+ parts

$2.021

10k+ parts

-

2,361

$2.245

$208.526

$2.021

-

DigiPath Technology Company

USA . 1,038 parts In-Stock

1+ parts

$2.473

100+ parts

-

1k+ parts

-

10k+ parts

-

1,038

$2.473

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-

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ChromeModa Solutions

Germany . 575 parts In-Stock

1+ parts

$2.523

100+ parts

$2.069

1k+ parts

-

10k+ parts

-

575

$2.523

$2.069

-

-

IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$2.523

100+ parts

-

1k+ parts

$2.271

10k+ parts

-

159

$2.523

-

$2.271

-

One Stop Electronics

USA . 190 parts In-Stock

1+ parts

$3.800

100+ parts

-

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10k+ parts

-

190

$3.800

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-

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$7.382

100+ parts

-

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10k+ parts

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254

$7.382

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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8,000

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Microchip USA

USA . 2,628 parts In-Stock

1+ parts

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2,628

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Corphita

USA . 195 parts In-Stock

1+ parts

-

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195

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Overview

Elevate your audio and video experience with the THS7303PWRG4 by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and performance for a wide range of applications. Whether you're enhancing your home entertainment system or optimizing professional audio setups, this compact and versatile amplifier delivers exceptional value and benefits. Trust in Texas Instruments' legacy of excellence to elevate your sound and visuals to new heights with the THS7303PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the amplifier easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and reducing assembly time.

No. of Channels: 3

Having 3 channels provides flexibility in connecting multiple audio/video sources, enhancing the overall performance.

Technology: BICMOS

BICMOS technology offers high performance with low power consumption, making the amplifier efficient and reliable.

Nominal Bandwidth: 41 kHz

The wide bandwidth ensures accurate and detailed sound reproduction, making the amplifier suitable for various audio applications.

Technical Specifications

Audio & Video Amplifiers THS7303PWRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

41 kHz

General IC Type:

Gain:

6 dB

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

24.6 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

THS7303PWRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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