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THS7319IZSVR

Texas Instruments

THS7319IZSVR by Texas Instruments

THS7319IZSVR by Texas Instruments is a video amplifier IC with 3 channels, BICMOS technology, and a nominal bandwidth of 13.5 kHz. It operates at industrial temperature grade (-40 to 85 °C) with power supplies of 2.6/5V, making it suitable for audio and video amplification applications in various devices.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76,100 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.030

10k+ parts

$0.918

76,100

-

$1.240

$1.030

$0.918

DigiKey

USA . 76,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.060

10k+ parts

-

76,100

-

-

$1.060

-

Verical

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.288

10k+ parts

$1.147

50,000

-

-

$1.288

$1.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,275 parts In-Stock

1+ parts

$0.969

100+ parts

-

1k+ parts

-

10k+ parts

-

1,275

$0.969

-

-

-

Vyrian

USA . 3,722 parts In-Stock

1+ parts

$1.020

100+ parts

-

1k+ parts

-

10k+ parts

-

3,722

$1.020

-

-

-

DigiKey Marketplace

USA . 77,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,042 parts In-Stock

1+ parts

$0.918

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

$0.918

-

-

-

Parana Technologies

USA . 1,159 parts In-Stock

1+ parts

$2.123

100+ parts

$197.120

1k+ parts

$1.910

10k+ parts

-

1,159

$2.123

$197.120

$1.910

-

DigiPath Technology Company

USA . 241 parts In-Stock

1+ parts

$2.337

100+ parts

$2.150

1k+ parts

-

10k+ parts

-

241

$2.337

$2.150

-

-

ChromeModa Solutions

Germany . 2,472 parts In-Stock

1+ parts

$2.385

100+ parts

$1.956

1k+ parts

-

10k+ parts

-

2,472

$2.385

$1.956

-

-

IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$2.385

100+ parts

-

1k+ parts

$2.146

10k+ parts

-

1,723

$2.385

-

$2.146

-

A-Z Elektronik GmbH

Germany . 5,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,634

-

-

-

-

Kepictronics

USA . 5,124 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,124

-

-

-

-

Assy Fe

Spain . 2,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,317

-

-

-

-

Microchip USA

USA . 128 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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128

-

-

-

-

Overview

Experience unparalleled audio and video amplification with the THS7319IZSVR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability in the audio & video amplifier category. This versatile amplifier is perfect for a wide range of applications, offering customers value and benefits such as crystal-clear sound and sharp visuals. Upgrade your audio and video experience today with the THS7319IZSVR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the amplifier, ensuring longevity and reliability.

Surface Mount: YES

The surface mount design allows for easy installation on circuit boards, making the amplifier compact and suitable for integration into various electronic devices.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, maximizing the overall design flexibility of the amplifier.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, this amplifier ensures high-quality video signal processing and enhancement.

Power Supplies (V): 2.6/5

Supporting dual power supplies of 2.6V and 5V, this amplifier can be versatilely used in different voltage scenarios for optimal performance.

No. of Terminals: 9

The 9 terminals allow for multiple connection points, enabling seamless integration with other components in the circuit for a smooth signal flow.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch ensures efficient heat dissipation and signal transmission, enhancing the overall performance of the amplifier.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high temperatures, making it suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance even in extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and connection to the circuit board, simplifying the installation process.

Maximum Seated Height: 0.45 mm

The low seated height of 0.45mm ensures a compact design, making this amplifier ideal for applications where space is limited.

Width: 1.5 mm

The slim width of 1.5mm contributes to the overall compactness of the amplifier, facilitating easy integration into various electronic devices.

Minimum Supply Voltage (Vsup): 2.6 V

The minimum supply voltage of 2.6V ensures efficient power consumption and reliable operation of the amplifier under different voltage conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and mounting of the amplifier on the circuit board for secure and stable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and mounting of the amplifier on the circuit board, ensuring a strong and durable connection.

Length: 1.5 mm

The compact length of 1.5mm contributes to the overall small form factor of the amplifier, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this amplifier can withstand harsh environmental conditions and rigorous operational requirements, ensuring long-term reliability and performance.

No. of Channels: 3

Featuring 3 channels, this amplifier can process and enhance multiple video signals simultaneously, making it ideal for multi-channel video applications.

Technology: BICMOS

Utilizing BICMOS technology, this amplifier combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Nominal Bandwidth: 13.5 kHz

With a nominal bandwidth of 13.5 kHz, this amplifier can process video signals with high fidelity and clarity, delivering excellent image quality.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections to the circuit board, preventing signal loss or interference for consistent video signal transmission.

Maximum Supply Current: 4.5 mA

With a maximum supply current of 4.5 mA, this amplifier operates efficiently and consumes low power, making it energy-efficient and cost-effective.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for compact and precise connections, ensuring accurate signal transmission and minimizing signal distortion.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this amplifier is resistant to moisture damage, ensuring long-term reliability and performance in humid environments.

Maximum Supply Voltage (Vsup): 5 V

Supporting a maximum supply voltage of 5V, this amplifier can handle higher voltage levels for enhanced performance and compatibility with different power sources.

Technical Specifications

Audio & Video Amplifiers THS7319IZSVR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

13.5 kHz

General IC Type:

JESD-30 Code:

S-PBGA-B9

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.6/5

Qualification:

Not Qualified

Maximum Seated Height:

.45 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

THS7319IZSVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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