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TDA8932BT/N2

NXP Semiconductors

TDA8932BT/N2 by NXP Semiconductors

NXP Semiconductors' TDA8932BT/N2 is a 22V audio amplifier IC with 32 terminals. It features dual functions, operates in industrial temperature range (-40 to 85°C), and draws max 50mA supply current. Ideal for audio applications requiring high-quality amplification in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,601 parts In-Stock

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4,601

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Anansix

USA . 2,269 parts In-Stock

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2,269

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Vyrian

USA . 1,513 parts In-Stock

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1,513

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Chip Stock

USA . 139 parts In-Stock

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139

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Distributors (Availability)

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Corohmni

South Africa . 339 parts In-Stock

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$2.259

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339

$2.259

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One Stop Electronics

USA . 821 parts In-Stock

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$2.800

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821

$2.800

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Aztec Data Supply Inc.

USA . 639 parts In-Stock

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$3.270

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639

$3.270

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Ampacity Inc.

Singapore . 1,286 parts In-Stock

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$6.800

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$6.800

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AZTECH Wire

Italy . 591 parts In-Stock

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$8.346

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591

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Lixinc

USA . 17,351 parts In-Stock

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Argo Parts USA

USA . 4,709 parts In-Stock

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Corphita

USA . 3,486 parts In-Stock

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Continental Prestige Electronics

USA . 2,177 parts In-Stock

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2,177

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UNI Independent Distributors

Spain . 570 parts In-Stock

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570

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unleash the power of superior audio quality with the TDA8932BT/N2 by NXP Semiconductors. As a renowned manufacturer in the industry, NXP Semiconductors has crafted this audio amplifier to deliver exceptional sound performance for a wide range of applications. Whether you're looking to enhance your home entertainment system or elevate your automotive audio experience, this product offers unparalleled value and benefits. Say goodbye to subpar audio and immerse yourself in the crisp, clear sound that only the TDA8932BT/N2 can provide. Elevate your listening experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the amplifier.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly in various electronic devices.

No. of Functions: 2

Having multiple functions in a single amplifier increases its versatility and usefulness in different audio and video applications.

Power Supplies (V): 22

This amplifier can handle power supplies up to 22V, making it suitable for applications that require higher voltage inputs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this amplifier can withstand prolonged usage and high temperature environments.

Maximum Supply Current: 50 mA

The 50mA maximum supply current ensures efficient power consumption and helps in reducing energy costs.

Technical Specifications

Audio & Video Amplifiers TDA8932BT/N2 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G32

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

22

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

50 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA8932BT/N2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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