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LMH6612MA

Texas Instruments

LMH6612MA by Texas Instruments

LMH6612MA by Texas Instruments is a video amplifier with 365 kHz bandwidth, operating from -40 to 125°C. It has 2 functions in an 8-terminal small outline package suitable for automotive applications. With a supply voltage range of 1.35V to 5.5V, it's ideal for audio and video amplification in compact designs.

Median Price

$2.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 102 parts In-Stock

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$2.900

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$1.900

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$1.900

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Vyrian

USA . 8,388 parts In-Stock

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Digiode

USA . 4,385 parts In-Stock

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Anansix

USA . 1,220 parts In-Stock

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Semi Source

USA . 89 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 876 parts In-Stock

1+ parts

$1.756

100+ parts

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$2.329

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876

$1.756

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DigiPath Technology Company

USA . 981 parts In-Stock

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$1.934

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$1.934

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ChromeModa Solutions

Germany . 2,914 parts In-Stock

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$1.973

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$1.618

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$1.973

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IDEA Electronic Components Group

UK . 1,734 parts In-Stock

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$1.973

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$1.776

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$1.973

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Component Stockers USA

USA . 208 parts In-Stock

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$2.670

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$1.910

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AZTECH Wire

Italy . 517 parts In-Stock

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$14.620

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One Stop Electronics

USA . 1,026 parts In-Stock

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$18.800

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Ampacity Inc.

Singapore . 1,126 parts In-Stock

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$19.800

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Corphita

USA . 3,936 parts In-Stock

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Continental Prestige Electronics

USA . 862 parts In-Stock

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Argo Parts USA

USA . 502 parts In-Stock

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Aranea Global

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Overview

Upgrade your audio and video systems with the LMH6612MA by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability in the Audio & Video Amplifiers category. This versatile VIDEO AMPLIFIER offers customers a compact design, wide operating temperature range, and easy surface mount installation. Whether you're enhancing your car stereo or home entertainment setup, the LMH6612MA provides the value, benefits, and advantages you need for superior sound and picture quality. Experience the difference with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the amplifier, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, making it suitable for compact and streamlined designs.

No. of Functions: 2

Provides versatility and flexibility in signal processing, allowing for multiple functions to be performed within a single amplifier.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various operating environments and reducing the risk of overheating.

Nominal Bandwidth: 365 kHz

Offers a wide bandwidth for handling high-frequency signals, ensuring accurate and clear audio and video output.

Technical Specifications

Audio & Video Amplifiers LMH6612MA attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATED IN 2.7V TO 11V SINGLE SUPPLY

Nominal Bandwidth:

365 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.35 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LMH6612MA General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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