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LMH6611MK

Texas Instruments

LMH6611MK by Texas Instruments

LMH6611MK by Texas Instruments is a video amplifier IC with 6 terminals, operating temperature range of -40 to 125°C. It has a nominal bandwidth of 365 kHz and supports supply voltage from 1.35V to 5.5V. Ideal for automotive applications due to its small outline package and high-temperature grade suitability.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 33,332 parts In-Stock

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Vyrian

USA . 2,121 parts In-Stock

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Digiode

USA . 1,722 parts In-Stock

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Anansix

USA . 578 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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EMSNET

USA . 8 parts In-Stock

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Parana Technologies

USA . 577 parts In-Stock

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$2.383

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$2.880

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DigiPath Technology Company

USA . 401 parts In-Stock

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$2.623

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$2.623

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ChromeModa Solutions

Germany . 6,732 parts In-Stock

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$2.677

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$2.195

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

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$2.677

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$2.409

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AZTECH Wire

Italy . 206 parts In-Stock

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$10.340

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Ampacity Inc.

Singapore . 893 parts In-Stock

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$20.800

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One Stop Electronics

USA . 855 parts In-Stock

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$21.800

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Authorized Procurement Solutions

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Lixinc

USA . 6,529 parts In-Stock

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Corphita

USA . 524 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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S.R.D Solutions

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Overview

Elevate your audio and video experiences with the LMH6611MK by Texas Instruments. Crafted with precision and quality in mind, this video amplifier offers unparalleled performance and reliability. Whether you're enhancing your home entertainment system or upgrading your automotive technology, this compact and versatile amplifier provides seamless integration and impressive clarity. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your audio and video experience. Upgrade today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the amplifier lightweight and durable, perfect for portable or automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly, saving time and increasing production efficiency.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video signals, ensuring high-quality video output and optimal performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this amplifier can withstand extreme conditions and operate reliably in various environments.

Minimum Supply Voltage (Vsup): 1.35 V

The low minimum supply voltage allows for compatibility with a wide range of power sources, making it versatile and adaptable.

Technical Specifications

Audio & Video Amplifiers LMH6611MK attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATED IN 2.7V TO 11V SINGLE SUPPLY

Nominal Bandwidth:

365 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

2.97 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.35 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.65 mm

Trade Compliance

LMH6611MK General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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