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THS4022IDR

Texas Instruments

THS4022IDR by Texas Instruments

THS4022IDR by Texas Instruments is a dual-channel video amplifier with 10dB gain and 350kHz bandwidth. It operates b/w -40 to 85°C, suitable for industrial applications. With a small outline package style and surface mount capability, it's ideal for audio & video amplification in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,928 parts In-Stock

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Digiode

USA . 1,505 parts In-Stock

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1,505

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Distributors (Availability)

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Parana Technologies

USA . 218 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

$1.571

10k+ parts

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218

$0.366

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$1.571

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ChromeModa Solutions

Germany . 3,118 parts In-Stock

1+ parts

$0.411

100+ parts

$0.337

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3,118

$0.411

$0.337

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IDEA Electronic Components Group

UK . 152 parts In-Stock

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$0.411

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-

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$0.370

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152

$0.411

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$0.370

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One Stop Electronics

USA . 1,274 parts In-Stock

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$7.800

100+ parts

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1,274

$7.800

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AZTECH Wire

Italy . 668 parts In-Stock

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$18.506

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668

$18.506

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A-Z Elektronik GmbH

Germany . 7,490 parts In-Stock

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7,490

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Corphita

USA . 2,458 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Speed Components Ltd (Excess)

Israel . 555 parts In-Stock

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555

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Microchip USA

USA . 402 parts In-Stock

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402

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Legend Electronics Inc. (Excess)

USA . 286 parts In-Stock

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286

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DigiPath Technology Company

USA . 22 parts In-Stock

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$0.371

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22

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$0.371

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Overview

Unleash the power of high-quality audio and video amplification with the Texas Instruments THS4022IDR. Crafted by a trusted manufacturer known for superior products, this small outline package offers customers unmatched value and performance. Perfect for applications in various industries, this video amplifier boasts 2 functions, dual terminals, and a nominal bandwidth of 350 kHz. Elevate your audio and video experience with the THS4022IDR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

No. of Functions: 2

Having multiple functions in one IC simplifies circuit designs and saves board space, making the product more versatile.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a circuit board and easy integration into existing equipment.

General IC Type: VIDEO AMPLIFIER

Being specifically designed for video amplification ensures high quality and reliable performance for video signal processing.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for more complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-saving and suitable for compact designs, making it ideal for portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extended use in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making it suitable for a variety of applications.

Terminal Position: DUAL

The dual terminal position allows for increased flexibility in layout and routing, facilitating easy integration into different circuit designs.

Maximum Seated Height: 1.75 mm

The low seated height saves space on the circuit board and allows for compact and slim designs.

Width: 3.9 mm

The small width of the package makes it suitable for applications where board space is limited.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows for operation in low-power applications, increasing energy efficiency.

Length: 4.9 mm

The compact length of the package is suitable for small form factor designs, making it ideal for portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments, making it suitable for industrial applications.

No. of Channels: 2

Having 2 channels allows for stereo sound output, making it suitable for audio amplification in multimedia applications.

Technology: BIPOLAR

The bipolar technology provides high-quality amplification with low noise and distortion, ensuring clear and accurate audio/video signals.

Nominal Bandwidth: 350 kHz

The wide bandwidth allows for accurate reproduction of audio and video signals, making it suitable for high-definition applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable connections, ensuring robust performance in harsh environments.

Terminal Pitch: 1.27 mm

The fine terminal pitch enables high-density mounting on circuit boards, saving space and accommodating complex circuit designs.

Gain: 10 dB

The 10 dB gain amplifies audio/video signals without introducing excessive noise, ensuring clear and crisp sound/video output.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage allows for flexibility in power supply options and ensures compatibility with a wide range of systems.

Technical Specifications

Audio & Video Amplifiers THS4022IDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 9 TO 32V SINGLE SUPPLY

Nominal Bandwidth:

350 kHz

General IC Type:

Gain:

10 dB

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS4022IDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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