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THS4021CIDGN

Texas Instruments

THS4021CIDGN by Texas Instruments

THS4021CIDGN by Texas Instruments is a video amplifier IC with 8 terminals, operating temperature range of -40 to 85°C, and nominal bandwidth of 350 kHz. It is used in audio/video applications due to its small outline package and industrial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,519 parts In-Stock

1+ parts

-

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4,519

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Digiode

USA . 1,650 parts In-Stock

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1,650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,110 parts In-Stock

1+ parts

$0.276

100+ parts

-

1k+ parts

$1.535

10k+ parts

-

2,110

$0.276

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$1.535

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DigiPath Technology Company

USA . 2,049 parts In-Stock

1+ parts

$0.304

100+ parts

$0.279

1k+ parts

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2,049

$0.304

$0.279

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ChromeModa Solutions

Germany . 3,464 parts In-Stock

1+ parts

$0.310

100+ parts

$0.254

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3,464

$0.310

$0.254

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IDEA Electronic Components Group

UK . 979 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

$0.279

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979

$0.310

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$0.279

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$6.276

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622

$6.276

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One Stop Electronics

USA . 405 parts In-Stock

1+ parts

$7.800

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405

$7.800

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Corphita

USA . 157 parts In-Stock

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157

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Overview

Experience superior audio and video quality with the THS4021CIDGN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability in all their products. This video amplifier is perfect for a wide range of applications, providing crystal-clear sound and sharp visuals. Whether you're a professional in the field or an enthusiast looking to enhance your home entertainment system, this product offers unbeatable value and benefits. Upgrade your audio and video experience today with the THS4021CIDGN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the amplifier easy to handle and transport.

Surface Mount: YES

The surface mount design allows for easy and efficient installation on circuit boards, saving time and effort.

Package Shape: SQUARE

The square shape helps in maximizing space utilization on the circuit board.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, ensuring high-quality video output.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, increasing flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability under various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this amplifier suitable for use in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance.

Width: 3 mm

The compact width allows for space-saving integration into circuit designs.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Nominal Bandwidth: 350 kHz

The high nominal bandwidth ensures high-quality video signal processing.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage allows for greater flexibility in system design.

Technical Specifications

Audio & Video Amplifiers THS4021CIDGN attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 9 TO 32V SINGLE SUPPLY

Nominal Bandwidth:

350 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

THS4021CIDGN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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