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THS4062CDGNRG4

Texas Instruments

THS4062CDGNRG4 by Texas Instruments

THS4062CDGNRG4 by Texas Instruments is a video amplifier with 2 functions, operating b/w 0-70°C. It has a bandwidth of 180 kHz and operates on a supply voltage range of 4.5-16V. Ideal for audio/video applications requiring high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,112 parts In-Stock

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Digiode

USA . 1,357 parts In-Stock

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1,357

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Nova Conductors

Japan . 65 parts In-Stock

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65

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Parana Technologies

USA . 1,013 parts In-Stock

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$2.489

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$2.981

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1,013

$2.489

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$2.981

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ChromeModa Solutions

Germany . 6,342 parts In-Stock

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$2.797

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$2.294

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$2.797

$2.294

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IDEA Electronic Components Group

UK . 1,817 parts In-Stock

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$2.797

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$2.517

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$2.517

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Ampacity Inc.

Singapore . 381 parts In-Stock

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$5.800

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381

$5.800

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One Stop Electronics

USA . 559 parts In-Stock

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$7.800

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559

$7.800

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AZTECH Wire

Italy . 765 parts In-Stock

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$14.222

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Corphita

USA . 4,455 parts In-Stock

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DigiPath Technology Company

USA . 2,334 parts In-Stock

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$2.522

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Continental Prestige Electronics

USA . 2,193 parts In-Stock

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Microchip USA

USA . 499 parts In-Stock

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499

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 244 parts In-Stock

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Overview

Elevate your audio and video experiences with the THS4062CDGNRG4 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-of-the-line audio and video amplifiers that cater to a wide range of applications. This compact and versatile device offers unmatched value, providing customers with enhanced performance and reliability. Upgrade your sound and visuals today with the THS4062CDGNRG4 and experience the difference TI amplifiers can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and protection for the amplifier circuit, ensuring reliable performance and longevity.

Surface Mount: YES

Surface mount capability makes it easy to integrate this amplifier into modern circuit board designs, saving space and facilitating automated assembly processes.

No. of Functions: 2

With 2 functions, this amplifier offers versatility in audio and video signal processing, making it a flexible choice for various applications.

Package Shape: SQUARE

The square package shape allows for easy orientation and positioning on the circuit board, enhancing assembly efficiency.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video signal amplification, this IC type ensures high-quality video output with minimal distortion or noise.

No. of Terminals: 8

With 8 terminals, this amplifier provides multiple input and output options, allowing for connections to various components in the system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures reliable performance under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C enables use in a wide range of temperature environments, from cold to hot.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options, accommodating different circuit board layouts.

Maximum Seated Height: 1.07 mm

The low maximum seated height of 1.07 mm ensures a compact footprint for the amplifier, suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3 mm enables space-efficient placement on the circuit board, saving valuable board real estate for other components.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V allows for operation in low-power applications or environments with limited power availability.

Length: 3 mm

The short length of 3 mm further contributes to the compact form factor of the amplifier, making it ideal for small electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making it suitable for a wide range of commercial applications.

Technology: BIPOLAR

Bipolar technology offers high linearity and low distortion, resulting in accurate and high-fidelity signal amplification for excellent audio and video output.

Nominal Bandwidth: 180 kHz

With a nominal bandwidth of 180 kHz, this amplifier can handle a wide range of audio and video frequencies, ensuring clear and detailed signal reproduction.

Terminal Form: GULL WING

The gull-wing terminal form provides easy soldering and connection to the circuit board, ensuring reliable electrical contact for optimal performance.

Maximum Supply Current: 21 mA

The low maximum supply current requirement of 21 mA indicates efficient power consumption, making it a cost-effective and energy-efficient choice.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the circuit board, maximizing space utilization and enabling compact system designs.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage capability of 16 V ensures compatibility with a wide range of power sources, providing flexibility in system integration.

Technical Specifications

Audio & Video Amplifiers THS4062CDGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 9V TO 32V SINGLE SUPPLY

Nominal Bandwidth:

180 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Current:

21 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

THS4062CDGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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