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THS4021CDRG4

Texas Instruments

THS4021CDRG4 by Texas Instruments

THS4021CDRG4 by Texas Instruments is a video amplifier with 8 terminals, operating b/w 0-70°C. It has a gain of 10 dB and nominal bandwidth of 350 kHz. This small outline package is ideal for audio & video applications requiring a supply voltage range of 4.5-16 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,819 parts In-Stock

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Digiode

USA . 1,154 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 597 parts In-Stock

1+ parts

$0.779

100+ parts

-

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$1.769

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597

$0.779

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$1.769

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DigiPath Technology Company

USA . 900 parts In-Stock

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$0.858

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$0.789

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900

$0.858

$0.789

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ChromeModa Solutions

Germany . 4,490 parts In-Stock

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$0.875

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$0.718

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4,490

$0.875

$0.718

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IDEA Electronic Components Group

UK . 152 parts In-Stock

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$0.875

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$0.788

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152

$0.875

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$0.788

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AZTECH Wire

Italy . 769 parts In-Stock

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$19.181

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769

$19.181

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One Stop Electronics

USA . 1,117 parts In-Stock

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$20.800

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Component Stockers USA

USA . 574 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,185 parts In-Stock

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Corphita

USA . 2,792 parts In-Stock

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Microchip USA

USA . 333 parts In-Stock

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Overview

Elevate your audio and video experience with the Texas Instruments THS4021CDRG4. This top-notch video amplifier offers unparalleled quality and reliability, thanks to its renowned manufacturer. Perfect for a wide range of applications in the audio and video industry, this product provides exceptional value by enhancing performance and clarity. Say goodbye to subpar sound and visuals - upgrade to the THS4021CDRG4 today and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the amplifier, making it long-lasting and resistant to damage.

Surface Mount: YES

Surface mount feature allows for easy installation and integration into electronic devices without the need for additional mounting hardware.

Package Shape: RECTANGULAR

Rectangular shape makes the amplifier easy to handle and fit into compact spaces within electronic devices.

General IC Type: VIDEO AMPLIFIER

Video amplifier specifically designed for amplifying video signals, ensuring high-quality video output.

No. of Terminals: 8

8 terminals provide multiple connection points for various input and output signals, offering versatility in usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for efficient placement within electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the amplifier can function in a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stability in signal connections.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact design, making the amplifier suitable for slim electronic devices.

Width: 3.9 mm

Small width dimension contributes to the amplifier's compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables the amplifier to operate efficiently with lower power sources.

Length: 4.9 mm

Short length dimension helps in accommodating the amplifier within limited space constraints of electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability for audio and video signal processing applications.

Nominal Bandwidth: 350 kHz

Wide nominal bandwidth ensures the amplifier can handle a broad range of video signal frequencies with precision.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection, simplifying the installation process.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with various circuit board designs and layouts.

Gain: 10 dB

10 dB gain amplifies video signals effectively, enhancing the overall video quality output.

Maximum Supply Voltage (Vsup): 16 V

High maximum supply voltage capability provides flexibility in power source options for the amplifier.

Technical Specifications

Audio & Video Amplifiers THS4021CDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 9 TO 32V SINGLE SUPPLY

Nominal Bandwidth:

350 kHz

General IC Type:

Gain:

10 dB

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS4021CDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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