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THS3125IDRG4

Texas Instruments

THS3125IDRG4 by Texas Instruments

THS3125IDRG4 by Texas Instruments is a video amplifier IC with 2 functions, operating at -40 to 85°C. It has a bandwidth of 160 kHz, suitable for audio/video applications. This small outline package IC supports supply voltage from 5V to 15V and is ideal for industrial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,916 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,916

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Digiode

USA . 4,599 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 519 parts In-Stock

1+ parts

$0.684

100+ parts

-

1k+ parts

$1.727

10k+ parts

-

519

$0.684

-

$1.727

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

$0.753

100+ parts

$0.692

1k+ parts

-

10k+ parts

-

793

$0.753

$0.692

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ChromeModa Solutions

Germany . 5,925 parts In-Stock

1+ parts

$0.768

100+ parts

$0.630

1k+ parts

-

10k+ parts

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5,925

$0.768

$0.630

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

$0.691

10k+ parts

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188

$0.768

-

$0.691

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AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$6.023

100+ parts

-

1k+ parts

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10k+ parts

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697

$6.023

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One Stop Electronics

USA . 1,243 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

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1,243

$11.800

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Corphita

USA . 977 parts In-Stock

1+ parts

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977

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Microchip USA

USA . 451 parts In-Stock

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451

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Overview

Experience unmatched audio and video quality with the THS3125IDRG4 by Texas Instruments. Known for their unparalleled expertise in manufacturing top-notch electronic components, Texas Instruments has crafted this video amplifier to deliver exceptional performance in a wide range of applications. Whether you're looking to enhance your home entertainment system or improve the sound quality in your vehicle, this product offers unbeatable value, benefits, and advantages that will surely impress even the most discerning customers. Upgrade your audio and video experience today with the THS3125IDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and durability, making the product resistant to damage and interference.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and making installation simpler.

No. of Functions: 2

Having multiple functions in one device saves on components and circuit complexity, making the product more efficient and cost-effective.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to work with, ensuring compatibility with standard mounting and assembly techniques.

General IC Type: VIDEO AMPLIFIER

Being a video amplifier, this product is specifically designed to enhance video signals, providing clear and sharp images.

No. of Terminals: 14

Having a higher number of terminals allows for more connections and options in circuit design, increasing versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and enables compact designs, ideal for portable devices or applications with limited space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability under various environmental conditions, making the product suitable for industrial use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature extends usability in cold environments, providing consistent performance in diverse settings.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connections, accommodating different design requirements.

Maximum Seated Height: 1.75 mm

Low seated height makes the product compact and allows for slim designs, suitable for applications with size constraints.

Width: 3.9 mm

Narrow width facilitates space-saving installation, enabling the product to be integrated into tight spaces or densely packed circuits.

Minimum Supply Voltage (Vsup): 5 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Length: 8.65 mm

Moderate length offers a good balance between compactness and functionality, suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh conditions, making the product reliable for industrial use.

Nominal Bandwidth: 160 kHz

High nominal bandwidth supports high-quality video signals with clear, detailed images, making the product ideal for video amplification.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering, ensuring robust and reliable electrical contacts.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration and compatibility with common PCB designs, simplifying assembly and installation.

Maximum Supply Voltage (Vsup): 15 V

High maximum supply voltage capability supports a wide range of power sources, providing flexibility in system design and compatibility.

Technical Specifications

Audio & Video Amplifiers THS3125IDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH SINGLE 10V TO 30 V SUPPLY

Nominal Bandwidth:

160 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS3125IDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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