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THS3112IDRG4

Texas Instruments

THS3112IDRG4 by Texas Instruments

THS3112IDRG4 by Texas Instruments is a video amplifier with 2 functions, operating temperature range of -40 to 85°C, and bandwidth of 110 kHz. Ideal for audio & video applications due to its small outline package style and industrial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,462 parts In-Stock

1+ parts

-

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7,462

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Digiode

USA . 3,785 parts In-Stock

1+ parts

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3,785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 707 parts In-Stock

1+ parts

$0.842

100+ parts

$78.187

1k+ parts

$0.758

10k+ parts

-

707

$0.842

$78.187

$0.758

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DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

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549

$0.927

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ChromeModa Solutions

Germany . 3,000 parts In-Stock

1+ parts

$0.946

100+ parts

$0.776

1k+ parts

-

10k+ parts

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3,000

$0.946

$0.776

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$0.946

100+ parts

-

1k+ parts

$0.851

10k+ parts

-

449

$0.946

-

$0.851

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$7.232

100+ parts

-

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622

$7.232

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One Stop Electronics

USA . 484 parts In-Stock

1+ parts

$16.800

100+ parts

-

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484

$16.800

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Corphita

USA . 3,513 parts In-Stock

1+ parts

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3,513

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Kepictronics

USA . 1,620 parts In-Stock

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1,620

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Microchip USA

USA . 256 parts In-Stock

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256

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Overview

Elevate your audio and video experience with the THS3112IDRG4 by Texas Instruments. Designed with precision and quality in mind, this video amplifier offers unparalleled performance and reliability. Perfect for a variety of applications in the audio and video industry, this product guarantees clear and crisp output every time. With Texas Instruments' reputation for excellence, you can trust that you are getting a top-of-the-line product that will exceed your expectations. Upgrade your systems today with the THS3112IDRG4 and enjoy the benefits of superior sound and picture quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and reduces the need for additional components, making the product cost-effective.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to handle and position on a circuit board, ensuring a secure fit.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality signal processing and sharp image output.

Width: 3.9 mm

Compact width allows for space-efficient placement on a circuit board, suitable for compact electronic devices.

Nominal Bandwidth: 110 kHz

High bandwidth capability supports the processing of high-frequency video signals, delivering clear and smooth video output.

Maximum Supply Voltage (Vsup): 15 V

High maximum supply voltage allows for versatility in power supply options, accommodating a wide range of electronic systems.

Technical Specifications

Audio & Video Amplifiers THS3112IDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 10 TO 30V SINGLE SUPPLY

Nominal Bandwidth:

110 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS3112IDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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