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THS1206QDAR

Texas Instruments

THS1206QDAR by Texas Instruments

THS1206QDAR by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at 6 MHz sample rate. Ideal for automotive applications, it offers 0.0439% max linearity error and supports binary output format. With a compact design and low power consumption, this converter is suitable for space-constrained environments requiring high-speed data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,766 parts In-Stock

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Digiode

USA . 252 parts In-Stock

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252

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Cyclops Electronics Ltd

UK . 70 parts In-Stock

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70

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Distributors (Availability)

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AZTECH Wire

Italy . 771 parts In-Stock

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$16.385

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771

$16.385

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Parana Technologies

USA . 1,738 parts In-Stock

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$24.823

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$25.499

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1,738

$24.823

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$25.499

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One Stop Electronics

USA . 337 parts In-Stock

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$26.000

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337

$26.000

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$27.333

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1,042

$27.333

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ChromeModa Solutions

Germany . 6,805 parts In-Stock

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$27.891

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$22.871

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6,805

$27.891

$22.871

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IDEA Electronic Components Group

UK . 454 parts In-Stock

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$27.891

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$26.496

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$25.102

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454

$27.891

$26.496

$25.102

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Lixinc

USA . 18,115 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,299 parts In-Stock

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Corphita

USA . 1,383 parts In-Stock

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Microchip USA

USA . 408 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Overview

Unlock the power of precision with the THS1206QDAR by Texas Instruments, a top-of-the-line Analog-to-Digital Converter designed to exceed expectations. Crafted with quality materials and cutting-edge technology, this versatile device offers unparalleled accuracy and reliability in a compact package. Ideal for a wide range of applications, from automotive to industrial settings, this converter delivers exceptional performance with a lightning-fast conversion time of just 0.175 microseconds. Experience the value of seamless integration and high-speed data acquisition with the THS1206QDAR - your ultimate solution for next-level digital processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internal components of the ADC, making it suitable for various applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatility in data acquisition and processing, making the ADC suitable for multi-channel applications.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide more accurate and precise digital representations of analog signals.

Maximum Conversion Time: 0.175 us

The fast conversion time of 0.175 microseconds ensures quick and efficient analog-to-digital conversion, suitable for real-time applications.

Sample Rate: 6 MHz

With a high sample rate of 6 MHz, this ADC can capture and process signals at a fast pace, making it ideal for high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, this ADC is suitable for automotive applications where temperature fluctuations are common.

Technical Specifications

Analog-to-Digital Converters THS1206QDAR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0439 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Maximum Conversion Time:

175 ns

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

1.3 V

Maximum Analog Input Voltage:

3.7 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

Trade Compliance

THS1206QDAR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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