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THS1206MDAREP

Texas Instruments

THS1206MDAREP by Texas Instruments

THS1206MDAREP by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at 6 MHz sample rate. Ideal for military applications, it offers high linearity (0.0439%) and operates b/w -55 to 125 °C. Package: Small Outline, Thin Profile, Shrink Pitch.

Median Price

$281.012

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,551 parts In-Stock

1+ parts

$239.160

100+ parts

$224.810

1k+ parts

$210.460

10k+ parts

-

2,551

$239.160

$224.810

$210.460

-

DigiKey

USA . 2,551 parts In-Stock

1+ parts

$298.950

100+ parts

-

1k+ parts

-

10k+ parts

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2,551

$298.950

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-

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Verical

USA . 1,746 parts In-Stock

1+ parts

-

100+ parts

$281.012

1k+ parts

$263.075

10k+ parts

-

1,746

-

$281.012

$263.075

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,954 parts In-Stock

1+ parts

$131.908

100+ parts

-

1k+ parts

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2,954

$131.908

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Vyrian

USA . 1,676 parts In-Stock

1+ parts

-

100+ parts

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1,676

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,624 parts In-Stock

1+ parts

$13.162

100+ parts

-

1k+ parts

$13.667

10k+ parts

-

1,624

$13.162

-

$13.667

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Corohmni

South Africa . 275 parts In-Stock

1+ parts

$13.992

100+ parts

-

1k+ parts

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10k+ parts

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275

$13.992

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ChromeModa Solutions

Germany . 4,013 parts In-Stock

1+ parts

$14.789

100+ parts

$12.127

1k+ parts

-

10k+ parts

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4,013

$14.789

$12.127

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$14.789

100+ parts

$14.050

1k+ parts

$13.310

10k+ parts

-

1,500

$14.789

$14.050

$13.310

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Ampacity Inc.

Singapore . 1,997 parts In-Stock

1+ parts

$118.020

100+ parts

-

1k+ parts

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10k+ parts

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1,997

$118.020

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Corphita

USA . 1,378 parts In-Stock

1+ parts

$124.965

100+ parts

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1,378

$124.965

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Continental Prestige Electronics

USA . 4,221 parts In-Stock

1+ parts

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4,221

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Argo Parts USA

USA . 2,026 parts In-Stock

1+ parts

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2,026

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DigiPath Technology Company

USA . 1,878 parts In-Stock

1+ parts

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100+ parts

$13.334

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10k+ parts

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1,878

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$13.334

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Kepictronics

USA . 1,220 parts In-Stock

1+ parts

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1,220

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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100

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Overview

Experience precision and reliability with the THS1206MDAREP by Texas Instruments, a top-tier manufacturer in the industry. This Analog-to-Digital Converter offers unparalleled quality and performance, making it ideal for a wide range of applications. Transform your projects with ease and efficiency using this innovative product that guarantees accurate results every time. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and propels your work to new heights. Elevate your work with the THS1206MDAREP and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the ADC, ensuring reliability and longevity.

No. of Analog In Channels: 4

Having multiple analog input channels allows for flexibility in connecting various sensors or sources to the ADC.

Surface Mount: YES

Surface mount technology makes it easier to integrate the ADC onto circuit boards, saving space and reducing assembly time.

No. of Bits: 12

Higher number of bits provides greater resolution and accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.0439%

Low linearity error ensures that the ADC accurately represents the input signal across its full range.

Power Supplies (V): 3.3,5

Supports multiple power supply voltages, offering flexibility in different system configurations.

No. of Terminals: 32

Sufficient number of terminals for connecting to external components or interfacing with the rest of the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design saves space on the PCB and allows for dense layout of components.

Minimum Supply Voltage: 3 V

Low minimum supply voltage enables operation in low-power applications or environments.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes the ADC suitable for use in harsh or extreme conditions.

Technical Specifications

Analog-to-Digital Converters THS1206MDAREP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0439 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1.4 V

Maximum Analog Input Voltage:

4 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

40 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1206MDAREP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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