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THS1030CDWG4

Texas Instruments

THS1030CDWG4 by Texas Instruments

THS1030CDWG4 by Texas Instruments is a 10-bit ADC with 30 MHz sample rate and 0.1953% linearity error. Ideal for commercial applications, it operates at temperatures from 0 to 70°C, with a supply voltage of 3.3V. The converter features binary output in parallel word format, making it suitable for various analog-to-digital conversion needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,514 parts In-Stock

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Vyrian

USA . 3,096 parts In-Stock

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3,096

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semicontronic

India . 876 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

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876

$8.000

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$7.760

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AZTECH Wire

Italy . 542 parts In-Stock

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$15.351

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542

$15.351

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Parana Technologies

USA . 2,290 parts In-Stock

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$20.183

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$20.143

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$20.183

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ChromeModa Solutions

Germany . 4,389 parts In-Stock

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$22.677

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$18.595

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$22.677

$18.595

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IDEA Electronic Components Group

UK . 929 parts In-Stock

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$22.677

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$21.543

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$20.409

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929

$22.677

$21.543

$20.409

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Ampacity Inc.

Singapore . 1,305 parts In-Stock

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$30.000

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One Stop Electronics

USA . 174 parts In-Stock

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$36.000

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Continental Prestige Electronics

USA . 5,886 parts In-Stock

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Corphita

USA . 1,909 parts In-Stock

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DigiPath Technology Company

USA . 1,300 parts In-Stock

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$20.446

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Argo Parts USA

USA . 622 parts In-Stock

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Microchip USA

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Aranea Global

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Overview

Elevate your analog-to-digital conversion with the THS1030CDWG4 by Texas Instruments. Renowned for their cutting-edge technology and precision engineering, Texas Instruments delivers top-notch quality in every product. The THS1030CDWG4 offers unparalleled value with its 10-bit resolution and fast 30 MHz sample rate, making it ideal for a wide range of applications. From industrial automation to medical devices, this ADC provides accurate and reliable data conversion, ensuring optimal performance in any project. Trust Texas Instruments to elevate your design with the THS1030CDWG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight and durable construction, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount feature enables easy and convenient installation in various electronic circuits.

No. of Bits: 10

10-bit resolution offers precise and accurate analog to digital conversion, resulting in high-quality digital data output.

Maximum Linearity Error (EL): 0.1953 %

Low linearity error ensures that the output digital data closely matches the input analog signal.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for flexibility in system integration and operation.

No. of Terminals: 28

Sufficient terminals enable a secure and reliable connection within the electronic circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range enables use in demanding environments without the risk of overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for analog to digital conversion.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method of analog to digital conversion ensures optimized performance and unique features in the converter.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is common and widely available, making it easy to integrate into various electronic systems.

Technical Specifications

Analog-to-Digital Converters THS1030CDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

30 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1030CDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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