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THS1408MPHPEP

Texas Instruments

THS1408MPHPEP by Texas Instruments

THS1408MPHPEP by Texas Instruments is a 14-bit ADC with 0.0641% EL, 3.3V supplies, and 8MHz sample rate. Ideal for military applications due to its MIL grade, it offers BINARY output format and operates in temperatures ranging from -55°C to 125°C.

Median Price

$78.880

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 109 parts In-Stock

1+ parts

$32.200

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$32.200

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Arrow

USA . 9 parts In-Stock

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$81.100

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$81.100

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Verical

USA . 9 parts In-Stock

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$81.100

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$81.100

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Rochester

USA . 51 parts In-Stock

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$76.660

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$68.590

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$64.550

51

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$76.660

$68.590

$64.550

DigiKey

USA . 51 parts In-Stock

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Digiode

USA . 3,534 parts In-Stock

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$19.285

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3,534

$19.285

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DigiKey Marketplace

USA . 51 parts In-Stock

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$38.510

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51

$38.510

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Nova Conductors

Japan . 700 parts In-Stock

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$39.988

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$39.988

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Vyrian

USA . 3,233 parts In-Stock

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Chip Stock

USA . 313 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 984 parts In-Stock

1+ parts

$7.532

100+ parts

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$8.042

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984

$7.532

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$8.042

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DigiPath Technology Company

USA . 294 parts In-Stock

1+ parts

$8.294

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$7.630

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294

$8.294

$7.630

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

1+ parts

$8.463

100+ parts

$8.040

1k+ parts

$7.617

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1,862

$8.463

$8.040

$7.617

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ChromeModa Solutions

Germany . 407 parts In-Stock

1+ parts

$8.463

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$6.940

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407

$8.463

$6.940

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AZTECH Wire

Italy . 354 parts In-Stock

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$16.893

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$16.893

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Ampacity Inc.

Singapore . 9 parts In-Stock

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$17.250

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Corphita

USA . 3,425 parts In-Stock

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$18.270

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Corohmni

South Africa . 217 parts In-Stock

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$23.373

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$23.373

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Semicontronic

India . 73 parts In-Stock

1+ parts

$37.550

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$36.611

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$36.424

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73

$37.550

$36.611

$36.424

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Component Stockers USA

USA . 180 parts In-Stock

1+ parts

$38.060

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$36.150

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180

$38.060

$36.150

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$39.101

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$39.101

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$39.101

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$39.101

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Continental Prestige Electronics

USA . 5,850 parts In-Stock

1+ parts

$39.988

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$39.189

5,850

$39.988

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$39.189

Netroflash

USA . 50 parts In-Stock

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$39.988

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$37.989

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$37.189

50

$39.988

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$37.189

Microchip USA

USA . 1,082 parts In-Stock

1+ parts

$88.570

100+ parts

$87.030

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$86.260

10k+ parts

$85.490

1,082

$88.570

$87.030

$86.260

$85.490

Kepictronics

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 4,968 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

USA . 837 parts In-Stock

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Overview

Enhance your analog-to-digital conversion experience with the THS1408MPHPEP by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers top-quality products like this ADC that offer unmatched precision and reliability. Whether you are working on military-grade applications or high-speed data acquisition projects, this converter excels with its fast sampling rate of 8 MHz and low linearity error of 0.0641%. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the THS1408MPHPEP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the package, making it suitable for various industrial applications.

No. of Bits: 14

With 14 bits resolution, this ADC can provide high accuracy and precision in converting analog signals to digital, making it ideal for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.0641%

The low linearity error ensures that the output digital values closely match the input analog signals, guaranteeing accurate and reliable conversion.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V, this ADC is compatible with a wide range of systems and can be easily powered without the need for additional voltage regulation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this ADC can withstand harsh environments and extended operating periods, ensuring reliability in demanding conditions.

Technology: CMOS

Utilizing CMOS technology, this ADC offers low power consumption, high speed, and compatibility with various digital systems, making it an efficient and versatile choice for analog-to-digital conversion.

Technical Specifications

Analog-to-Digital Converters THS1408MPHPEP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Other Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0641 %

Sample Rate:

8 MHz

Hold Mode:

Sample

Maximum Conversion Time:

125 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-3.3 V

Maximum Analog Input Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

90 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1408MPHPEP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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