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THS10082CDARG4

Texas Instruments

THS10082CDARG4 by Texas Instruments

THS10082CDARG4 by Texas Instruments is a 10-bit Analog-to-Digital Converter with 0.098% EL, suitable for commercial applications. It features 2 analog in channels, operates at temperatures from 0-70°C, and supports power supplies of 3.3V and 5V. This CMOS technology device comes in a small outline package with dual terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,001 parts In-Stock

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3,001

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Digiode

USA . 729 parts In-Stock

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729

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Distributors (Availability)

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AZTECH Wire

Italy . 676 parts In-Stock

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$17.809

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676

$17.809

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Parana Technologies

USA . 872 parts In-Stock

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$24.453

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$25.120

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872

$24.453

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$25.120

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ChromeModa Solutions

Germany . 4,801 parts In-Stock

1+ parts

$27.475

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$22.530

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4,801

$27.475

$22.530

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IDEA Electronic Components Group

UK . 2,066 parts In-Stock

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$27.475

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$26.101

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$24.728

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2,066

$27.475

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One Stop Electronics

USA . 550 parts In-Stock

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$32.000

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550

$32.000

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Corphita

USA . 1,279 parts In-Stock

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1,279

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DigiPath Technology Company

USA . 74 parts In-Stock

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$24.771

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74

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$24.771

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Overview

Experience the exceptional quality and precision of Texas Instruments with the THS10082CDARG4 Analog-to-Digital Converter. This innovative product offers unmatched performance for a variety of applications, ensuring accurate and reliable results every time. With a compact design and advanced technology, this converter provides customers with value, efficiency, and versatility like never before. Upgrade your projects with the trusted brand of Texas Instruments and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging helps to provide durability and protection for the internal components of the Analog-to-Digital Converter, ensuring long-term reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for simultaneous conversion of two analog signals, making the converter suitable for applications that require multiple input channels.

Surface Mount: YES

Being surface mountable allows for easy integration onto a printed circuit board and saves space, making it ideal for compact electronic designs.

No. of Bits: 10

The 10-bit resolution provides a high level of accuracy and precision in converting analog signals to digital, making it suitable for applications that require fine measurements.

Maximum Linearity Error (EL): 0.098 %

The low linearity error ensures that the converted digital output closely matches the input analog signal, allowing for accurate and reliable data conversion.

Power Supplies (V): 3.3,5

Supporting multiple power supply voltages (3.3V and 5V) provides flexibility in powering the Analog-to-Digital Converter, accommodating different system requirements.

No. of Terminals: 32

Having 32 terminals allows for easy connectivity and integration with other components, making installation and setup of the converter straightforward.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch packaging style saves space and allows for a compact design, making it suitable for applications with limited board space.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the Analog-to-Digital Converter can reliably function in a wide range of operating environments without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes the converter suitable for use in colder environments without compromising performance.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures secure connections, reducing the risk of signal loss or disconnection during operation.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating indicates that the converter is suitable for use in standard commercial applications, providing reliable performance in typical operating conditions.

Technology: CMOS

The CMOS technology used in the Analog-to-Digital Converter offers low power consumption, high speed, and excellent noise immunity, making it ideal for energy-efficient and high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable connections to the circuit board, ensuring robust and durable mounting of the converter.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Supporting both binary and 2's complement binary output bit codes provides versatility in data representation, accommodating a wide range of digital signal processing applications.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635mm, the converter offers fine pitch connections for precise and stable electrical connections, ensuring optimal signal integrity and performance.

Technical Specifications

Analog-to-Digital Converters THS10082CDARG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.098 %

Electrical Specifications

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

Trade Compliance

THS10082CDARG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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