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THS1206IDARG4

Texas Instruments

THS1206IDARG4 by Texas Instruments

THS1206IDARG4 by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at 6 MHz sample rate. Ideal for industrial applications, it offers 0.0366% linearity error, 3V min supply voltage, and a compact package style of small outline thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,412 parts In-Stock

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2,412

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Digiode

USA . 89 parts In-Stock

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$4.000

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567

$4.000

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AZTECH Wire

Italy . 214 parts In-Stock

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$6.941

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214

$6.941

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Parana Technologies

USA . 1,392 parts In-Stock

1+ parts

$8.033

100+ parts

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$8.615

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1,392

$8.033

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$8.615

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ChromeModa Solutions

Germany . 6,069 parts In-Stock

1+ parts

$9.026

100+ parts

$7.401

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6,069

$9.026

$7.401

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IDEA Electronic Components Group

UK . 870 parts In-Stock

1+ parts

$9.026

100+ parts

$8.575

1k+ parts

$8.123

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870

$9.026

$8.575

$8.123

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Microchip USA

USA . 1,471 parts In-Stock

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1,471

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Corphita

USA . 1,468 parts In-Stock

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1,468

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DigiPath Technology Company

USA . 781 parts In-Stock

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$8.138

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781

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$8.138

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Overview

Experience unparalleled precision and reliability with the THS1206IDARG4 by Texas Instruments. As a trusted leader in analog-to-digital converters, Texas Instruments delivers top-notch quality and performance in every product. The THS1206IDARG4 is ideal for a wide range of applications, providing customers with unmatched value and benefits. Whether you need high-speed data conversion or precise measurements, this converter offers exceptional accuracy and efficiency. Trust Texas Instruments to meet your needs with cutting-edge technology and superior craftsmanship.

Feature Benefit Bullets

No. of Analog In Channels: 4

Having 4 analog input channels allows for the conversion of multiple analog signals simultaneously, increasing efficiency and flexibility in data acquisition.

No. of Bits: 12

With 12 bits, this ADC can provide higher resolution and accuracy in converting analog signals to digital, making it suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.0366%

The low maximum linearity error ensures accurate conversion of analog signals to digital, making this product reliable for critical applications where precision is essential.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) provides compatibility with different system requirements, enhancing the versatility of this ADC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this ADC to perform reliably in various industrial environments with elevated temperatures.

Sample Rate: 6 MHz

With a high sample rate of 6 MHz, this ADC can quickly convert analog signals to digital, making it suitable for applications requiring fast data acquisition and processing.

Technology: CMOS

Utilizing CMOS technology enables this ADC to operate efficiently with low power consumption while maintaining high performance, making it an energy-efficient choice for various applications.

Technical Specifications

Analog-to-Digital Converters THS1206IDARG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0366 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Maximum Conversion Time:

175 ns

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

1.4 V

Maximum Analog Input Voltage:

3.7 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

40 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1206IDARG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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