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TCAN334D

Texas Instruments

TCAN334D by Texas Instruments

TCAN334D by Texas Instruments is an automotive-grade network interface IC with 1Mbps data rate. It operates b/w -40 to 125°C, ideal for harsh environments. With a small outline package and nickel palladium gold finish, it's suitable for telecom interface circuits.

Median Price

$2.686

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,913 parts In-Stock

1+ parts

$2.182

100+ parts

$1.912

1k+ parts

$1.080

10k+ parts

-

2,913

$2.182

$1.912

$1.080

-

Mouser Electronics

USA . 330 parts In-Stock

1+ parts

$3.190

100+ parts

$1.920

1k+ parts

$1.800

10k+ parts

$1.700

330

$3.190

$1.920

$1.800

$1.700

DigiKey

USA . 297 parts In-Stock

1+ parts

$3.190

100+ parts

$2.015

1k+ parts

$1.805

10k+ parts

$1.669

297

$3.190

$2.015

$1.805

$1.669

Arrow

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$1.652

1k+ parts

$1.484

10k+ parts

$1.283

300

-

$1.652

$1.484

$1.283

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$1.900

-

-

-

Digiode

USA . 831 parts In-Stock

1+ parts

$2.073

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$2.073

-

-

-

Chip Stock

USA . 43,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43,500

-

-

-

-

Vyrian

USA . 2,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,649

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 821 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

821

$1.400

-

-

-

Semicontronic

India . 522 parts In-Stock

1+ parts

$1.400

100+ parts

$1.365

1k+ parts

$1.358

10k+ parts

-

522

$1.400

$1.365

$1.358

-

Continental Prestige Electronics

USA . 1,847 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

$1.862

1,847

$1.900

-

-

$1.862

Argo Parts USA

USA . 1,287 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,287

$1.900

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$1.900

100+ parts

$1.805

1k+ parts

$1.715

10k+ parts

$1.691

10

$1.900

$1.805

$1.715

$1.691

Corphita

USA . 1,621 parts In-Stock

1+ parts

$1.964

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

$1.964

-

-

-

Advanced Electronics

New Zealand . 80 parts In-Stock

1+ parts

$6.386

100+ parts

$6.067

1k+ parts

$6.067

10k+ parts

-

80

$6.386

$6.067

$6.067

-

Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$7.243

100+ parts

-

1k+ parts

$7.745

10k+ parts

-

2,347

$7.243

-

$7.745

-

IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$8.138

100+ parts

-

1k+ parts

$7.324

10k+ parts

-

2,151

$8.138

-

$7.324

-

ChromeModa Solutions

Germany . 265 parts In-Stock

1+ parts

$8.138

100+ parts

$6.673

1k+ parts

-

10k+ parts

-

265

$8.138

$6.673

-

-

Corohmni

South Africa . 257 parts In-Stock

1+ parts

$9.286

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$9.286

-

-

-

Formix International (Excess)

India . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Infinite Electronics LLP (Excess)

. 1,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,001

-

-

-

-

DigiPath Technology Company

USA . 871 parts In-Stock

1+ parts

-

100+ parts

$7.337

1k+ parts

-

10k+ parts

-

871

-

$7.337

-

-

Perfect Parts

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

504

-

-

-

-

Overview

Enhance your network interfaces with the TCAN334D from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. With its compact size and robust design, the TCAN334D offers unmatched performance in automotive environments. Experience seamless connectivity and superior data transmission at 1 Mbps with this interface circuit. Trust Texas Instruments to provide innovative solutions that exceed your expectations. Elevate your networking capabilities with the TCAN334D today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard PCB layouts and easy integration into existing systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and compatibility with different interfaces and networks.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact designs in networking equipment.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can operate reliably in a variety of environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and compatibility with different PCB layouts.

Maximum Seated Height: 1.75 mm

Low seated height enables the product to be used in slim and compact devices without compromising performance.

Width: 3.9 mm

Compact width makes the product suitable for space-constrained applications and PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time ensures the product can withstand high temperatures during assembly without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering and assembly processes.

Length: 4.9 mm

Optimal length for easy integration and compatibility with standard PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures the product can withstand harsh environmental conditions in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering for efficient assembly and installation.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications in the telecom industry, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 3.3 V

Suitable nominal supply voltage for reliable operation and compatibility with standard power sources in networking equipment.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy installation and connections on standard PCB layouts.

Data Rate: 1 Mbps

Supports data rates up to 1 Mbps, suitable for high-speed networking applications and data transfer.

Technical Specifications

Network Interfaces TCAN334D attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TCAN334D Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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