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TCAN1462VDRBRQ1

Texas Instruments

TCAN1462VDRBRQ1 by Texas Instruments

TCAN1462VDRBRQ1 by Texas Instruments is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 125°C. It features a small outline package with 8 terminals and nickel palladium gold finish. Ideal for automotive applications due to AEC-Q100 screening and compact design.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 30,391 parts In-Stock

1+ parts

$1.112

100+ parts

$0.855

1k+ parts

$0.450

10k+ parts

-

30,391

$1.112

$0.855

$0.450

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$1.410

100+ parts

$0.822

1k+ parts

$0.731

10k+ parts

-

3,000

$1.410

$0.822

$0.731

-

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$1.440

100+ parts

$0.839

1k+ parts

$0.722

10k+ parts

$0.670

210

$1.440

$0.839

$0.722

$0.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,933 parts In-Stock

1+ parts

$1.056

100+ parts

-

1k+ parts

-

10k+ parts

-

4,933

$1.056

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$1.120

-

-

-

Chip Stock

USA . 11,054 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,054

-

-

-

-

Vyrian

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,104 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

11,104

$0.950

-

-

-

Semicontronic

India . 10,955 parts In-Stock

1+ parts

$0.950

100+ parts

$0.926

1k+ parts

$0.922

10k+ parts

-

10,955

$0.950

$0.926

$0.922

-

Corphita

USA . 1,159 parts In-Stock

1+ parts

$1.001

100+ parts

-

1k+ parts

-

10k+ parts

-

1,159

$1.001

-

-

-

Argo Parts USA

USA . 4,021 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

4,021

$1.120

-

-

-

Continental Prestige Electronics

USA . 1,840 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

$1.098

1,840

$1.120

-

-

$1.098

Parana Technologies

USA . 382 parts In-Stock

1+ parts

$6.129

100+ parts

-

1k+ parts

$6.899

10k+ parts

-

382

$6.129

-

$6.899

-

DigiPath Technology Company

USA . 1,708 parts In-Stock

1+ parts

$6.749

100+ parts

-

1k+ parts

-

10k+ parts

-

1,708

$6.749

-

-

-

ChromeModa Solutions

Germany . 5,741 parts In-Stock

1+ parts

$6.887

100+ parts

$5.647

1k+ parts

-

10k+ parts

-

5,741

$6.887

$5.647

-

-

IDEA Electronic Components Group

UK . 1,110 parts In-Stock

1+ parts

$6.887

100+ parts

-

1k+ parts

$6.198

10k+ parts

-

1,110

$6.887

-

$6.198

-

Corohmni

South Africa . 307 parts In-Stock

1+ parts

$7.426

100+ parts

-

1k+ parts

-

10k+ parts

-

307

$7.426

-

-

-

AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$11.870

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$11.870

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$13.711

100+ parts

$13.026

1k+ parts

$13.026

10k+ parts

-

10

$13.711

$13.026

$13.026

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.098

1k+ parts

$1.064

10k+ parts

$1.042

1,000

-

$1.098

$1.064

$1.042

Overview

Elevate your network interface game with the TCAN1462VDRBRQ1 by Texas Instruments. Designed with precision and expertise, this CAN FD transceiver offers unparalleled quality and reliability. Perfect for a wide range of applications, this small outline, heat sink package delivers high-speed data rates up to 8 Mbps, making it an essential component for cutting-edge telecom projects. Experience seamless connectivity and superior performance with Texas Instruments' TCAN1462VDRBRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto circuit boards, saving space and making installation efficient.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality, making this product suitable for automotive applications where ruggedness is essential.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V makes this product compatible with standard power sources, offering ease of integration.

Data Rate: 8 Mbps

The high data rate of 8 Mbps allows for fast and efficient data communication, making this product suitable for high-speed applications.

Technical Specifications

Network Interfaces TCAN1462VDRBRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

8 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

130 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TCAN1462VDRBRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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