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TCA8418YFPR

Texas Instruments

TCA8418YFPR by Texas Instruments

TCA8418YFPR by Texas Instruments is a telecom IC with 25 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 1.8V and is designed for industrial applications requiring telecom circuit interface in a square grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,133 parts In-Stock

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6,133

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Digiode

USA . 928 parts In-Stock

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928

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,461 parts In-Stock

1+ parts

$9.337

100+ parts

-

1k+ parts

$9.960

10k+ parts

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1,461

$9.337

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$9.960

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DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

$10.281

100+ parts

$9.459

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96

$10.281

$9.459

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ChromeModa Solutions

Germany . 6,282 parts In-Stock

1+ parts

$10.491

100+ parts

$8.603

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6,282

$10.491

$8.603

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$10.491

100+ parts

$9.966

1k+ parts

$9.442

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537

$10.491

$9.966

$9.442

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AZTECH Wire

Italy . 778 parts In-Stock

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$17.607

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778

$17.607

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One Stop Electronics

USA . 127 parts In-Stock

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$454.000

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127

$454.000

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Corphita

USA . 551 parts In-Stock

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551

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Overview

Discover a world of seamless connectivity with the Texas Instruments TCA8418YFPR, a top-of-the-line telecom interface IC designed to revolutionize communication systems. Proudly manufactured by Texas Instruments, this innovative product boasts unparalleled quality and reliability. Its versatile applications in various industries make it a must-have for any tech-savvy individual or company looking to stay ahead of the curve. Experience the value and benefits of this cutting-edge technology, offering unmatched performance and efficiency. Upgrade your systems today with the TCA8418YFPR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to damage, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and cost.

Package Shape: SQUARE

The square package shape ensures compatibility with standard PCB layouts, making integration seamless.

No. of Terminals: 25

Having 25 terminals provides versatility and connectivity options for various telecom interface applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density mounting and improved signal integrity, enhancing performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring reliability.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C enables this product to function well in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and design, optimizing space and improving signal routing.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in demanding industrial applications.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and facilitates soldering during assembly.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC type offers optimized functionality and performance for telecommunications applications.

Nominal Supply Voltage: 1.8 V

With a low nominal supply voltage of 1.8V, this product offers energy efficiency and reduced power consumption in operation.

Technical Specifications

Other Function Telecom Interface ICs TCA8418YFPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

TCA8418YFPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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