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TB5D2HDWE4

Texas Instruments

TB5D2HDWE4 by Texas Instruments

TB5D2HDWE4 by Texas Instruments is a 16-terminal line driver with 3.6V max supply voltage, 3.5ns max transmit delay, and 0ns max receive delay. Ideal for industrial applications requiring differential output and standard input characteristics in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,861

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-

-

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Digiode

USA . 2,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,825

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,913 parts In-Stock

1+ parts

$3.565

100+ parts

-

1k+ parts

$4.088

10k+ parts

-

1,913

$3.565

-

$4.088

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DigiPath Technology Company

USA . 1,749 parts In-Stock

1+ parts

$3.926

100+ parts

-

1k+ parts

-

10k+ parts

-

1,749

$3.926

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-

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ChromeModa Solutions

Germany . 6,380 parts In-Stock

1+ parts

$4.006

100+ parts

$3.285

1k+ parts

-

10k+ parts

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6,380

$4.006

$3.285

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

1+ parts

$4.006

100+ parts

-

1k+ parts

$3.605

10k+ parts

-

2,095

$4.006

-

$3.605

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AZTECH Wire

Italy . 667 parts In-Stock

1+ parts

$7.205

100+ parts

-

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10k+ parts

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667

$7.205

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One Stop Electronics

USA . 1,350 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

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10k+ parts

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1,350

$14.500

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Corphita

USA . 727 parts In-Stock

1+ parts

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727

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Overview

Enhance your electronic systems with the TB5D2HDWE4 by Texas Instruments, a top-of-the-line Line Driver & Receiver that delivers unparalleled quality and reliability. Crafted by the reputable manufacturer, Texas Instruments, this product offers customers unmatched value and benefits. With a maximum supply voltage of 3.6V, 4 functions, and a small outline package style, this versatile component is ideal for a wide range of applications. Experience seamless performance and precision with the TB5D2HDWE4, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making this product versatile and compatible with various systems.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, leading to a more compact and cost-effective solution.

Maximum Transmit Delay: 3.5 ns

Offers fast signal transmission, enabling high-speed data transfer and communication in demanding applications.

Power Supplies (V): 3.3/5

Flexible power supply options allow for compatibility with different voltage standards, enhancing the product's versatility.

No. of Terminals: 16

Sufficient terminals for connecting to external devices and components, providing ample connectivity options in a compact package.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making it suitable for industrial use.

Technical Specifications

Line Drivers & Receivers TB5D2HDWE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

7.5 mm

Trade Compliance

TB5D2HDWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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