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TB5D1MDWE4

Texas Instruments

TB5D1MDWE4 by Texas Instruments

TB5D1MDWE4 by Texas Instruments is a Line Driver with 3.6V max supply voltage, 3.5ns max transmit delay, and 4 functions. Ideal for industrial applications requiring differential output and standard input characteristics in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,318 parts In-Stock

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Digiode

USA . 4,246 parts In-Stock

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4,246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 626 parts In-Stock

1+ parts

$1.500

100+ parts

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626

$1.500

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Parana Technologies

USA . 602 parts In-Stock

1+ parts

$5.056

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$5.621

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602

$5.056

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$5.621

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DigiPath Technology Company

USA . 1,948 parts In-Stock

1+ parts

$5.567

100+ parts

$5.122

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1,948

$5.567

$5.122

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ChromeModa Solutions

Germany . 2,688 parts In-Stock

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$5.681

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$4.658

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2,688

$5.681

$4.658

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IDEA Electronic Components Group

UK . 2,372 parts In-Stock

1+ parts

$5.681

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$5.113

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2,372

$5.681

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$5.113

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AZTECH Wire

Italy . 650 parts In-Stock

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$17.125

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650

$17.125

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Corphita

USA . 2,136 parts In-Stock

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Overview

Enhance your electronic designs with the TB5D1MDWE4 by Texas Instruments, a top-of-the-line line driver & receiver that guarantees quality and reliability. With a wide range of applications in various industries, this product showcases the unmatched expertise of its manufacturer. Offering seamless transmission and superior performance, the TB5D1MDWE4 stands out for its value, benefits, and advantages, ensuring that customers receive optimal results every time. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is suitable for a variety of voltage requirements, making it versatile for different applications.

No. of Functions: 4

Having 4 functions in one unit provides cost savings, space efficiency, and simplifies the design of a system by reducing the number of components needed.

Maximum Transmit Delay: 3.5 ns

The low transmit delay of 3.5ns ensures fast and efficient data transmission, making it ideal for high-speed applications.

Power Supplies (V): 3.3/5

The product can operate with power supplies of either 3.3V or 5V, providing flexibility in voltage requirements for different applications.

Package Shape: RECTANGULAR

The rectangular package shape is easy to handle and integrate into existing designs, making it convenient for electronic system integration.

Maximum High Level Input Current: 0.0001 Amp

The low input current requirement of 0.0001A helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even at lower voltage levels, providing a wider range of compatibility with different systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes the product suitable for industrial applications where temperature variations are common.

Output Characteristics: 3-STATE

The 3-state output feature allows the driver to be in one of three output states, enabling flexibility in controlling the output signal and reducing power consumption when the output is not needed.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold as terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability in various environmental conditions.

Differential Output: YES

The differential output ensures better noise immunity, signal integrity, and longer transmission distances, making it suitable for applications where noise rejection is critical.

Technical Specifications

Line Drivers & Receivers TB5D1MDWE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

7.5 mm

Trade Compliance

TB5D1MDWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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