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TB5D1MLDW

Texas Instruments

TB5D1MLDW by Texas Instruments

TB5D1MLDW by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 3.3/5V. It features a max transmit delay of 3.5ns and differential output capability, suitable for industrial temperature grade applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,667 parts In-Stock

1+ parts

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8,667

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Digiode

USA . 4,208 parts In-Stock

1+ parts

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4,208

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Prism Electronics

USA . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,995 parts In-Stock

1+ parts

$5.424

100+ parts

$503.669

1k+ parts

$4.881

10k+ parts

-

1,995

$5.424

$503.669

$4.881

-

DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$5.972

100+ parts

-

1k+ parts

-

10k+ parts

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849

$5.972

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ChromeModa Solutions

Germany . 6,288 parts In-Stock

1+ parts

$6.094

100+ parts

$4.997

1k+ parts

-

10k+ parts

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6,288

$6.094

$4.997

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IDEA Electronic Components Group

UK . 388 parts In-Stock

1+ parts

$6.094

100+ parts

-

1k+ parts

$5.485

10k+ parts

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388

$6.094

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$5.485

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$14.890

100+ parts

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462

$14.890

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One Stop Electronics

USA . 1,143 parts In-Stock

1+ parts

$39.500

100+ parts

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1,143

$39.500

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Corphita

USA . 2,805 parts In-Stock

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2,805

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Enhance your electronic applications with the TB5D1MLDW by Texas Instruments, a top-quality line driver & receiver designed for optimal performance. With a reputation for excellence, Texas Instruments delivers unmatched reliability and precision in their products. This versatile device is perfect for a wide range of applications, offering customers unparalleled value and benefits. Upgrade your projects today with the TB5D1MLDW and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 4

Supports multiple functions in a single device, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into various system designs.

Maximum Transmit Delay: 3.5 ns

Fast transmit delay ensures quick signal transmission in high-speed applications.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, providing flexibility in power requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB and simplifies layout design.

Maximum High Level Input Current: 0.0001 Amp

Low input current consumption helps in reducing power dissipation.

Minimum Supply Voltage: 3 V

Allows operation at low supply voltages, conserving power.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling output signals.

Minimum Operating Temperature: -40 °C

Operates reliably in harsh environments with low temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for easy soldering and connection.

Maximum Seated Height: 2.65 mm

Low profile design minimizes the overall height of the device on the PCB.

Width: 7.5 mm

Compact width for efficient space utilization on the PCB.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Supports peak reflow temperature for a specified duration during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature for reliable soldering during assembly.

Length: 10.3 mm

Optimal length for fitting into compact system designs.

Minimum Out Swing: 0.5 V

Low minimum output swing for efficient signal transmission.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures quick response to incoming signals.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical stability.

Input Characteristics: STANDARD

Standard input characteristics for compatibility with various signal sources.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage ensures optimal performance and reliability.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy PCB layout and soldering.

Driver No. of Bits: 4

Supports 4 bits for accurate and efficient signal transmission.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 for safe storage and handling of the device.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver for efficient signal amplification and transmission.

Technical Specifications

Line Drivers & Receivers TB5D1MLDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

7.5 mm

Trade Compliance

TB5D1MLDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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