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TB5D2HDR

Texas Instruments

TB5D2HDR by Texas Instruments

TB5D2HDR by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 3.3/5 V power supplies. It features a max transmit delay of 3.5 ns and differential output, suitable for industrial applications requiring high-speed signal transmission in compact spaces.

Median Price

$11.570

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,208 parts In-Stock

1+ parts

$11.570

100+ parts

$10.107

1k+ parts

$6.970

10k+ parts

-

31,208

$11.570

$10.107

$6.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,959 parts In-Stock

1+ parts

$10.992

100+ parts

-

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-

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-

1,959

$10.992

-

-

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Vyrian

USA . 7,357 parts In-Stock

1+ parts

-

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-

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-

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7,357

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-

-

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Bristol Electronics

USA . 992 parts In-Stock

1+ parts

-

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992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,198 parts In-Stock

1+ parts

$2.861

100+ parts

-

1k+ parts

$3.352

10k+ parts

-

1,198

$2.861

-

$3.352

-

DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$3.151

100+ parts

$2.899

1k+ parts

-

10k+ parts

-

1,179

$3.151

$2.899

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ChromeModa Solutions

Germany . 4,986 parts In-Stock

1+ parts

$3.215

100+ parts

$2.636

1k+ parts

-

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-

4,986

$3.215

$2.636

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IDEA Electronic Components Group

UK . 528 parts In-Stock

1+ parts

$3.215

100+ parts

-

1k+ parts

$2.894

10k+ parts

-

528

$3.215

-

$2.894

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Corphita

USA . 2,769 parts In-Stock

1+ parts

$10.413

100+ parts

-

1k+ parts

-

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2,769

$10.413

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AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$14.940

100+ parts

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835

$14.940

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Component Stockers USA

USA . 999 parts In-Stock

1+ parts

$147.070

100+ parts

-

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999

$147.070

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A-Z Elektronik GmbH

Germany . 7,401 parts In-Stock

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7,401

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 2,352 parts In-Stock

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2,352

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Lixinc

USA . 1,301 parts In-Stock

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1,301

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Kepictronics

USA . 76 parts In-Stock

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76

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Overview

Unleash the power of seamless communication with the TB5D2HDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that guarantee reliability and efficiency. Whether you're looking to enhance your industrial automation systems or boost the performance of your communication networks, this product offers unparalleled value with its fast transmit delay, 3-state output characteristics, and differential output capability. Elevate your operations and stay ahead of the competition with the TB5D2HDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the IC, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can operate within a wide range of supply voltages, providing flexibility in design and compatibility with multiple systems.

No. of Functions: 4

Offers multiple functions in a single IC, reducing the need for additional components and simplifying circuit design.

Maximum Transmit Delay: 3.5 ns

Low transmit delay ensures fast signal transmission, making it suitable for high-speed communication applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus sharing and reducing the risk of bus contention.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications where temperature variations are common.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity in long-distance communications.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of input signals, enhancing versatility.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal supply voltage, ensuring compatibility with common power sources.

Technical Specifications

Line Drivers & Receivers TB5D2HDR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

3.5 ns

Width:

3.9 mm

Trade Compliance

TB5D2HDR Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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