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TB5D2HDWRE4

Texas Instruments

TB5D2HDWRE4 by Texas Instruments

TB5D2HDWRE4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 3.5ns max transmit delay, and 4 functions. Ideal for industrial applications requiring differential output and standard input characteristics in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,120

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-

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Vyrian

USA . 2,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,809

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,405 parts In-Stock

1+ parts

$4.378

100+ parts

-

1k+ parts

$4.795

10k+ parts

-

1,405

$4.378

-

$4.795

-

ChromeModa Solutions

Germany . 6,409 parts In-Stock

1+ parts

$4.919

100+ parts

$4.034

1k+ parts

-

10k+ parts

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6,409

$4.919

$4.034

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

1+ parts

$4.919

100+ parts

-

1k+ parts

$4.427

10k+ parts

-

1,259

$4.919

-

$4.427

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AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$19.536

100+ parts

-

1k+ parts

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10k+ parts

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279

$19.536

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One Stop Electronics

USA . 1,273 parts In-Stock

1+ parts

$42.500

100+ parts

-

1k+ parts

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10k+ parts

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1,273

$42.500

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Corphita

USA . 1,512 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,512

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

-

100+ parts

$4.435

1k+ parts

-

10k+ parts

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1,355

-

$4.435

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Overview

Enhance your electronics projects with the TB5D2HDWRE4 by Texas Instruments, a top-tier manufacturer known for exceptional quality. As a versatile Line Driver & Receiver device, this product offers superior performance and reliability in a compact package. Whether you're working on communication systems, industrial automation, or automotive applications, this innovative solution provides unmatched value with its fast transmit delay, low power consumption, and wide operating temperature range. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TB5D2HDWRE4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the line drivers & receivers from damage, ensuring long-lasting performance.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a range of power supply configurations, offering flexibility in various applications.

No. of Functions: 4

Offers multiple functions in a single device, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts and designs, optimizing space utilization within electronic devices.

Maximum Transmit Delay: 3.5 ns

Ensures fast and efficient data transmission, enhancing the overall performance of the line drivers & receivers.

Power Supplies (V): 3.3/5

Supports different power supply voltages, making the product versatile and suitable for a variety of applications.

No. of Terminals: 16

Provides ample connection points for interfacing with other electronic components, offering flexibility in circuit configurations.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high-temperature environments, making the line drivers & receivers suitable for industrial applications.

Output Characteristics: 3-STATE

Allows for high impedance output state, enabling greater control over signal routing and synchronization in complex electronic systems.

Technical Specifications

Line Drivers & Receivers TB5D2HDWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.5 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

7.5 mm

Trade Compliance

TB5D2HDWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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