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TAS5076PFCG4

Texas Instruments

TAS5076PFCG4 by Texas Instruments

TAS5076PFCG4 by Texas Instruments is a 3.3V consumer IC with 80 terminals in a square package. It operates b/w 0-70°C, has a terminal finish of NiPdAu, and is suitable for consumer circuit applications requiring a thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,208 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 288 parts In-Stock

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288

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Digiode

USA . 210 parts In-Stock

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210

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Distributors (Availability)

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Parana Technologies

USA . 1,910 parts In-Stock

1+ parts

$2.257

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$2.758

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1,910

$2.257

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$2.758

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ChromeModa Solutions

Germany . 2,651 parts In-Stock

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$2.536

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$2.080

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2,651

$2.536

$2.080

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

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$2.536

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$2.282

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1,651

$2.536

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$2.282

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AZTECH Wire

Italy . 239 parts In-Stock

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$8.596

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239

$8.596

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One Stop Electronics

USA . 1,390 parts In-Stock

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$16.800

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1,390

$16.800

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Component Stockers USA

USA . 441 parts In-Stock

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$99.990

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441

$99.990

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Corphita

USA . 2,310 parts In-Stock

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DigiPath Technology Company

USA . 665 parts In-Stock

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$2.286

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665

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Microchip USA

USA . 408 parts In-Stock

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Overview

Discover the TAS5076PFCG4 by Texas Instruments, a top-quality consumer circuit IC designed to deliver exceptional performance and reliability. With Texas Instruments' reputation for innovation and excellence, this IC is perfect for a wide range of applications in the consumer electronics industry. From its compact design to its advanced features, the TAS5076PFCG4 offers unmatched value and benefits to customers looking for high-quality solutions. Upgrade your products with this cutting-edge IC today and stand out from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for consumer electronics.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

Power Supplies (V): 3.3

With a power supply of 3.3V, this product is compatible with a wide range of consumer electronic devices, offering versatility in its applications.

No. of Terminals: 80

The high number of terminals allows for complex circuit connections, enabling the IC to perform multiple functions efficiently.

Temperature Grade: COMMERCIAL

Being rated for commercial use means that this product is suitable for a wide range of consumer electronics applications, ensuring reliability and performance.

Technical Specifications

Other Function Consumer ICs TAS5076PFCG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TAS5076PFCG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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