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SRC4184IPAGTG4

Texas Instruments

SRC4184IPAGTG4 by Texas Instruments

SRC4184IPAGTG4 by Texas Instruments is a 64-terminal IC with 3.3V power supply, operating b/w -40 to 85°C. Its thin profile flatpack package makes it suitable for industrial consumer circuit applications requiring a min supply voltage of 1.65V and max seated height of 1.2mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,227 parts In-Stock

1+ parts

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7,227

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Digiode

USA . 909 parts In-Stock

1+ parts

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909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 647 parts In-Stock

1+ parts

$0.207

100+ parts

-

1k+ parts

$1.519

10k+ parts

-

647

$0.207

-

$1.519

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ChromeModa Solutions

Germany . 6,348 parts In-Stock

1+ parts

$0.233

100+ parts

$0.191

1k+ parts

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6,348

$0.233

$0.191

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IDEA Electronic Components Group

UK . 1,740 parts In-Stock

1+ parts

$0.233

100+ parts

-

1k+ parts

$0.210

10k+ parts

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1,740

$0.233

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$0.210

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AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$18.320

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547

$18.320

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One Stop Electronics

USA . 1,037 parts In-Stock

1+ parts

$18.800

100+ parts

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1,037

$18.800

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Corphita

USA . 1,926 parts In-Stock

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1,926

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DigiPath Technology Company

USA . 1,225 parts In-Stock

1+ parts

-

100+ parts

$0.210

1k+ parts

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1,225

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$0.210

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Overview

Elevate your consumer electronics with the SRC4184IPAGTG4 by Texas Instruments, a top-quality IC designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers reliable performance and durability. This versatile IC offers customers exceptional value and benefits, making it the perfect choice for your next project. Explore the possibilities with the SRC4184IPAGTG4 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to external elements, making the product suitable for long-term use in various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operating at 3.3V provides a reliable power source for the consumer circuit, ensuring stable performance and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand heat and operate efficiently in demanding industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Width: 10 mm

The compact width of 10mm allows for efficient use of space on the circuit board, making it suitable for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product meets higher temperature and performance requirements, ensuring reliable operation in harsh working conditions.

Technical Specifications

Other Function Consumer ICs SRC4184IPAGTG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES ON 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SRC4184IPAGTG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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