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SRC4192QDBRQ1

Texas Instruments

SRC4192QDBRQ1 by Texas Instruments

SRC4192QDBRQ1 by Texas Instruments is a consumer IC with 28 terminals in a small outline package. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V, it features nickel palladium gold terminal finish and can withstand peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,472 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,472

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Digiode

USA . 2,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 181 parts In-Stock

1+ parts

$3.231

100+ parts

-

1k+ parts

$3.753

10k+ parts

-

181

$3.231

-

$3.753

-

DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$3.557

100+ parts

$3.273

1k+ parts

-

10k+ parts

-

2,127

$3.557

$3.273

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ChromeModa Solutions

Germany . 3,582 parts In-Stock

1+ parts

$3.630

100+ parts

$2.977

1k+ parts

-

10k+ parts

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3,582

$3.630

$2.977

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IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

$3.267

10k+ parts

-

325

$3.630

-

$3.267

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$17.704

100+ parts

-

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10k+ parts

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283

$17.704

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One Stop Electronics

USA . 1,359 parts In-Stock

1+ parts

$18.800

100+ parts

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1,359

$18.800

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Corphita

USA . 1,229 parts In-Stock

1+ parts

-

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1,229

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Overview

Unleash the power of innovation with the SRC4192QDBRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality consumer ICs that redefine connectivity and efficiency. The SRC4192QDBRQ1 is designed for a wide range of applications, offering unparalleled performance and reliability. With its compact package body and advanced technology, this product provides customers with unmatched value and benefits. Elevate your projects to the next level with the SRC4192QDBRQ1 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and insulation for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the IC into various electronic devices and circuit layouts.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can handle demanding operating conditions without overheating.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the IC to function reliably in both extreme cold and hot environments.

Width: 5.3 mm

Compact width enables the IC to be used in space-constrained applications without sacrificing performance.

Technical Specifications

Other Function Consumer ICs SRC4192QDBRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SRC4192QDBRQ1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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