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SRC4193IDBRG4

Texas Instruments

SRC4193IDBRG4 by Texas Instruments

SRC4193IDBRG4 by Texas Instruments is a 28-terminal IC with 3.3V power supply, operating b/w -45 to 85°C. It features small outline packaging and is ideal for consumer circuit applications requiring a compact design and industrial temperature grade reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,234 parts In-Stock

1+ parts

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3,234

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Vyrian

USA . 2,550 parts In-Stock

1+ parts

-

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2,550

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,029 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

$1.503

10k+ parts

-

2,029

$0.163

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$1.503

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DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

$0.179

100+ parts

-

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1,332

$0.179

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ChromeModa Solutions

Germany . 5,965 parts In-Stock

1+ parts

$0.183

100+ parts

$0.150

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5,965

$0.183

$0.150

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IDEA Electronic Components Group

UK . 2,171 parts In-Stock

1+ parts

$0.183

100+ parts

-

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$0.165

10k+ parts

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2,171

$0.183

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$0.165

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Ampacity Inc.

Singapore . 1,206 parts In-Stock

1+ parts

$2.800

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1,206

$2.800

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One Stop Electronics

USA . 199 parts In-Stock

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$2.800

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199

$2.800

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AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$5.060

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466

$5.060

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Continental Prestige Electronics

USA . 5,171 parts In-Stock

1+ parts

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5,171

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Corphita

USA . 4,626 parts In-Stock

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4,626

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,637 parts In-Stock

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1,637

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Overview

Enhance your consumer electronics with the SRC4193IDBRG4 by Texas Instruments, a top-quality consumer circuit IC that offers unmatched performance and reliability. Manufactured by a trusted industry leader, this versatile component is designed for a wide range of applications in various electronic devices. Experience the value of seamless integration and superior functionality with this compact, high-performance IC. Upgrade your products today with Texas Instruments' SRC4193IDBRG4 for enhanced efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the IC from external elements, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy assembly onto a PCB, saving space and reducing manufacturing costs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and optimal performance in consumer electronics.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without overheating, ensuring reliable operation even in harsh environments.

Minimum Operating Temperature: -45 °C

Capable of operating in low temperature conditions, making it suitable for use in a variety of climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Width: 5.3 mm

Compact size allows for easy integration into small form factor devices, saving space on the PCB.

Temperature Grade: INDUSTRIAL

Certified for industrial applications, ensuring reliability and durability in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering, ensuring secure connections on the PCB.

Technical Specifications

Other Function Consumer ICs SRC4193IDBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SRC4193IDBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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