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SRC4190IDBRG4

Texas Instruments

SRC4190IDBRG4 by Texas Instruments

SRC4190IDBRG4 by Texas Instruments is a consumer IC with 28 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage range of 3-3.6V and peak reflow temperature of 260°C. This rectangular-shaped IC is ideal for industrial applications requiring precise consumer circuit functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,424 parts In-Stock

1+ parts

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7,424

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Digiode

USA . 4,352 parts In-Stock

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4,352

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Bristol Electronics

USA . 449 parts In-Stock

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449

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,266 parts In-Stock

1+ parts

$2.509

100+ parts

-

1k+ parts

$2.997

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1,266

$2.509

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$2.997

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DigiPath Technology Company

USA . 751 parts In-Stock

1+ parts

$2.763

100+ parts

$2.542

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-

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751

$2.763

$2.542

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ChromeModa Solutions

Germany . 4,439 parts In-Stock

1+ parts

$2.819

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$2.312

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4,439

$2.819

$2.312

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IDEA Electronic Components Group

UK . 456 parts In-Stock

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$2.819

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$2.537

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456

$2.819

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$2.537

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One Stop Electronics

USA . 554 parts In-Stock

1+ parts

$9.800

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554

$9.800

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AZTECH Wire

Italy . 592 parts In-Stock

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$14.702

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592

$14.702

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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Kepictronics

USA . 3,449 parts In-Stock

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3,449

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Corphita

USA . 1,694 parts In-Stock

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1,694

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Overview

Elevate your consumer electronics with the Texas Instruments SRC4190IDBRG4, a high-quality consumer circuit that delivers top-notch performance and reliability. Designed with precision and expertise by Texas Instruments, this small outline, shrink pitch package offers versatility and durability for a wide range of applications. With a minimum operating temperature of -40°C and a maximum operating temperature of 85°C, this innovative IC is built to withstand even the most demanding environments. Trust in Texas Instruments to provide cutting-edge solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package body lightweight and durable, which is ideal for consumer applications.

Surface Mount: YES

Being surface mountable makes installation easier and more compact, suitable for modern consumer electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, contributing to a compact overall design.

Power Supplies (V): 3.3

Operating at 3.3V is a common voltage level for many consumer devices, ensuring compatibility with various power sources.

No. of Terminals: 28

Having a high number of terminals allows for more connections and functionalities in the circuit, making the product versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand heat and perform reliably in various conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Technical Specifications

Other Function Consumer ICs SRC4190IDBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.65V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SRC4190IDBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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